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Erschienen in:
2001 | OriginalPaper | Buchkapitel
Ceramic and Plastic Pin Grid Array Technology
verfasst von : Balaram Ghosal, Richard Sigliano, Y. Kunimatsu
Erschienen in: Area Array Interconnection Handbook
Verlag: Springer US
Enthalten in: Professional Book Archive
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The technology surrounding integrated circuits has improved drastically since first introduced in 1959. The desire to miniaturize circuits, coupled with increased speed and decreased energy consumption requirements has led to present day highly integrated circuits. To take advantage of the integration enhancements at the die level, much attention is focused on the supporting package performance.