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Journal of Materials Science
Erschienen in: Journal of Materials Science 17/2016

31.05.2016 | Original Paper

Copper–graphite composites: thermal expansion, thermal and electrical conductivities, and cross-property connections

Erschienen in: Journal of Materials Science | Ausgabe 17/2016

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Abstract

The paper focuses on thermal and electrical properties of copper–graphite composites. Copper–graphite composites in the range of 0–50 vol% of graphite were prepared from the mixture of copper and graphite powder by the powder metallurgy method. Such composites combine high thermal and electrical conductivities provided by copper matrix and low thermal expansion coefficient and lubricating properties due to the graphite phase. We model thermal and electrical conductivities and thermal expansion coefficient using methods of micromechanics in connection with the material microstructure and measure these quantities experimentally to compare with the results of modeling. Cross-property connections between thermal and electrical properties of the composites are established and experimentally verified.
Vorheriger Artikel Ultra-low-κ HFPDB-based periodic mesoporous organosilica film with high mechanical strength for interlayer dielectric
Nächster Artikel Carbon foam decorated with silver particles and in situ grown nanowires for effective electromagnetic interference shielding

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Metadaten
Titel
Copper–graphite composites: thermal expansion, thermal and electrical conductivities, and cross-property connections
Publikationsdatum
31.05.2016
Erschienen in
Journal of Materials Science / Ausgabe 17/2016
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-016-0067-5

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