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Erschienen in:
01.12.2012
Deposition potential dependence of composition, microstructure, and surface morphology of electrodeposited Ni–Cu alloy films
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 12/2012
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Abstract
Composition, microstructure, and surface morphology of Ni–Cu alloy films electrodeposited at different deposition potentials have been investigated. The microstructural analysis carried out by using X-ray diffraction (XRD) confirmed that all Ni–Cu films are polycrystalline in nature and possess face-centered cubic structure. XRD analysis also revealed that the (111) peak of the Ni–Cu alloy films splits into two as Cu-rich and Ni-rich peaks and the peak intensities change depending on the deposition potential and hence the film composition. Compositional analysis of Ni–Cu films carried out by energy dispersive X-ray spectroscopy showed that Ni content within the films increases as the deposition potential becomes more negative. The morphological analysis performed by using a scanning electron microscopy and an atomic force microscopy revealed that the surface morphology changes significantly with applied deposition potential. Furthermore, a direct correlation is observed between the surface roughness and lattice strain.