Editorial to special issue on design, test, integration and packaging of MEMS/MOEMS, 2007

Excerpt

The symposium on design, test, integration and packaging of MEMS/MOEMS (DTIP) was held in Stresa, Italy, 25–27 April 2007, as a follow up to previous issues held in 1999 and 2000 in Paris, France, in 2001, 2002, 2003 in Mandelieu-La Napoule, France, in 2004 and 2005 in Montreux, Switzerland, and in 2006 in Stresa, Italy. This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. The symposium is traditionally composed of two conferences running in parallel: one on CAD, design and test (CDT), and another one on microfabrication, integration and packaging (MIP). In addition, participants of both conferences can attend invited talks and special Workshops. …