nach oben

Journal of Materials Science: Materials in Electronics

Erschienen in:

12.10.2015

Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy

verfasst von: Zhongmin Lai, Dan Ye

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2016

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

Effect of Al on the microstructure and mechanical properties were investigated. The results showed that Al could depress the formation of eutectic phase in Sn–Cu–Al solder alloy. The intermetallic compounds of Sn–0.7Cu–0.03Al were refined compared with that of Sn–0.7Cu–0.015Al. Segregated CuAl intermetallic compound was observed in Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al solder alloy. Sn-whisker was observed on the polished surface of Sn–0.7Cu–0.15Al and Sn–0.7Cu–0.5Al. The ultimate tensile strength of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was found to be higher than that of Sn–0.7Cu–xAl (x = 0, 0.015 and 0.15). The elongation of Sn–0.7Cu–0.015Al was the highest. The creep performance of Sn–0.7Cu–0.03Al and Sn–0.7Cu–0.5Al was similar and higher than that of Sn–0.7Cu and Sn–0.7Cu–0.15Al.

Vorheriger Artikel Capacitive properties of nanocomposite (FeCoZr) x (PZT)(100−x) produced by sputtering with the use of argon and oxygen ions beam

Nächster Artikel Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 340 Zeitschriften

aus folgenden Fachgebieten:

Bauwesen + Immobilien
Business IT + Informatik
Finance + Banking
Management + Führung
Marketing + Vertrieb
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

J.D. Wu, P.J. Zheng, C.W. Lee et al., A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectron. Reliab. 46, 41–52 (2006)CrossRef

J. Osenbach, A. Amin, M. Bachman et al., Stability of flip-chip interconnects assembled with Al/Ni(V)/Cu-UBM and eutectic Pb–Sn solder during exposure to high-temperature storage. J. Electron. Mater. 38, 303–324 (2009)CrossRef

H.R. Kotadia, A. Panneerselvam, O. Mokhtari et al., Massive spalling of Cu–Zn and Cu–Al intermetallic compounds at the interface between solders and Cu substrate during liquid state reaction. J. Appl. Phys. 111, 2720–2731 (2012)CrossRef

J.F. Li, P.A. Agyakwa, C.M. Johnson, Effect of trace Al on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate. J. Alloys Compd. 545, 70–79 (2012)CrossRef

F. Somidin, M.A.A.M. Salleh, K.R. Ahmad, Intermetallic compound formation on solder alloy/Cu-substrate interface using lead-free Sn–0.7Cu/recycled-aluminum composite solder. Adv. Mater. Res. 620, 105–111 (2012)CrossRef

M.F.M. Sabri, D.A. Shnawah, I.A. Badruddin et al., Microstructural stability of Sn–1Ag–0.5Cu–xAl (x = 1, 1.5, and 2 wt.%) solder alloys and the effects of high-temperature aging on their mechanical properties. Mater. Charact. 78, 129–143 (2013)CrossRef

A. Kantarcıoğlu, Y.E. Kalay, Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders. Mater. Sci. Eng. A 593, 79–84 (2014)CrossRef

D. Shnawah, S. Said, M. Sabri et al., Microstructure and tensile properties of Sn–1Ag–0.5Cu solder alloy bearing Al for electronics applications. J. Electron. Mater. 41, 2073–2082 (2012)CrossRef

R. Kolenák, R. Augustin, M. Martinkovic et al., Comparison study of SAC405 and SAC405+0.1%Al lead free solders. Solder. Surf. Mt. Technol. 25, 175–183 (2013)CrossRef

10.

R. Mahmudi, A.R. Geranmayeh, H. Noori et al., Effects of Ag and Al additions on the structure and creep properties of Sn–9Zn solder alloy. J. Electron. Mater. 38, 330–337 (2009)CrossRef

11.

M. Alam, M. Gupta, Development of extremely ductile lead-free Sn–Al solders for futuristic electronic packaging applications. Electron. Mater. Lett. 10, 515–524 (2014)CrossRef

12.

Y. Wang, X. Zhao, Y. Liu et al., Microstructure, wetting property of Sn–Ag–Cu–Bi–xCe solder and IMC growth at solder/Cu interface during thermal cycling. Rare Met. (2015). doi:10.1007/s12598-015-0526-1

13.

C. Li, Z. Liu, Microstructure and growth mechanism of tin whiskers on RESn3 compounds. Acta Mater. 61, 589–601 (2013)CrossRef

14.

H. Hao, Y. Shi, Z. Xia et al., Oxidization-induced tin whisker growth on the surface of Sn–3.8Ag–0.7Cu–1.0Er alloy. Metall. Mater. Trans. A 40, 2016–2021 (2009)CrossRef

15.

H. Hao, G. Xu, Y. Song et al., A model for rapid tin whisker growth on the surface of ErSn3 phase. J. Electron. Mater. 41, 184–189 (2012)CrossRef

16.

A.A. El-Daly, A.E. Hammad, A. Fawzy, D.A. Nasrallh, Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions. Mater. Des. 43, 40–49 (2013)CrossRef

17.

L. Zhang, J.G. Han, Y.H. Guo et al., Creep behavior of SnAgCu solders containing nano-Al particles. J. Mater. Sci. Mater. Electron. 26, 3615–3620 (2015)CrossRef

18.

A.R. Geranmayeh, R. Mahmudi, F. Khalatbari, N. Kashi, G. Nayyeri, Indentation creep of lead-free Sn–5Sb solder alloy with 1.5 wt% Ag and Bi additions. J. Electron. Mater. 43, 717–723 (2014)CrossRef

19.

P.A. Korzhavyi, R. Sandström, First-principles evaluation of the effect of alloying elements on the lattice parameter of a 23Cr25NiWCuCo austenitic stainless steel to model solid solution hardening contribution to the creep strength. Mater. Sci. Eng. A 626, 213–219 (2015)CrossRef

Titel: Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy
verfasst von: Zhongmin Lai
Dan Ye
Publikationsdatum: 12.10.2015
Verlag: Springer US
Erschienen in: Journal of Materials Science: Materials in Electronics / Ausgabe 2/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-015-3870-x

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Springer Professional "Wirtschaft"

Weitere Artikel der Ausgabe 2/2016

Controllable preparation of 2D and 3D ZnO micro-nanostructures and their photoelectric conversion efficiency

Theoretical investigation of quantum tunneling and self-energy phenomena in Al2O3/PVP nanocomposite

Tuning of band gap and photoluminescence properties of Zn doped Cu2S thin films by CBD method

Electrical and optical properties of Co2+:SnO2 thin films deposited by spray pyrolysis technique

Effect of cobalt doping on structural, dielectric and magnetodielectric properties of Ba0.95Sr0.05TiO3 ceramics

Synthesis and microwave absorption properties of Fe3O4@BaTiO3/reduced graphene oxide nanocomposites