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Erschienen in:
16.10.2015
Prediction model of lifetime for copper pillar bumps under coupling effects of current and thermal cycling
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2016
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Abstract
Considering the current induced voids flow will accelerate the creep strain rate and lower the strength of the solder, a current induced activation energy change, ΔQe is added in the Anand model. A lifetime prediction model was constructed based on linear damage rule for the current-thermal cycling coupling test. To verify the accuracy of the model, mean-time-to-failure (MTTF) of copper pillar has been experimentally and analytically investigated under the combination of thermal cycling with temperature range of −40 to 125 °C and a superimposed electric current with current densities of 17.4–22.4 × 104 A/cm2. The experimental results reveal that the MTTF sharply decreases with the increasing current density. The acceleration factors are calculated, which is consistent well with the prediction model.