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Journal of Materials Engineering and Performance

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23.05.2022 | Technical Article

Effect of Hard Cyclic Viscoplastic Deformation on the Microstructure, Mechanical Properties, and Electrical Conductivity of Cu-Cr Alloy

verfasst von: Lembit Kommel, Jacques Huot, Babak Omranpour Shahreza

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 12/2022

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Abstract

This paper presents the effect of a new processing technique called hard cyclic viscoplastic deformations (HCVD) on the enhancement of mechanical and electrical properties in a copper-chromium alloy. A modern severe plastic deformations (SPD) technique named “Indirect Extrusion Angular Pressing” (IEAP) was also implemented to refine the microstructure before HCVD. Samples were processed by IEAP, HCVD, and IEAP followed by HCVD, and the evolution of microstructure, mechanical properties, and electrical conductivity was analyzed. Results of materials characterization revealed that HCVD dissolved the Cr particles, reduced the microstrains, and transformed the elongated microstructure to an equiaxed structure in the SPD-induced copper. Results of mechanical testing showed that HCVD enhanced the elongation of SPD-processed samples at the cost of a slight decrease in strength and hardness. Further, aging treatment at different temperatures was conducted on the samples. Results showed that HCVD-processed samples retained the dislocation densities in the microstructure and possessed the highest hardness and electrical conductivity after aging. Such enhancement was attributed to the effect of HCVD on the relaxation of severely deformed grain boundaries as well as the contribution of HCVD to the full dissolution of Cr residuals, and subsequently, the formation of Cr sub-precipitates after aging.

Vorheriger Artikel Microstructure and Mechanical Properties of 2219 Aluminum Alloy/T2 Copper Explosively Welded Composite Plate

Nächster Artikel Effect of Electromagnetic Stirring Frequency on Inconel625-High Strength Low Alloy Steel Functionally Graded Material Fabricated by Wire Arc Additive Manufacturing

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Titel: Effect of Hard Cyclic Viscoplastic Deformation on the Microstructure, Mechanical Properties, and Electrical Conductivity of Cu-Cr Alloy
verfasst von: Lembit Kommel
Jacques Huot
Babak Omranpour Shahreza
Publikationsdatum: 23.05.2022
Verlag: Springer US
Erschienen in: Journal of Materials Engineering and Performance / Ausgabe 12/2022
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-022-06997-w

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