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Journal of Materials Engineering and Performance
Erschienen in: Journal of Materials Engineering and Performance 8/2020

03.08.2020

Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys

verfasst von: Jianglei Fan, Hengtao Zhai, Zhanyun Liu, Xiao Wang, Ying Li, Hongxia Gao, Jianxiu Liu

Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 8/2020

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Abstract

Sn-Cu based solders have been widely investigated due to their good mechanical properties, good fluidity, narrow melting range, environmental friendliness, and low price. In this paper, the effect of Ni content on the microstructure, mechanical properties, melting behavior, spreadability, and conductivity of Sn-0.7 Cu-xNi (0.5-2.0 mass%, mass fraction except when specified) lead-free solders was studied. The Sn-0.7Cu-xNi (x = 0.5, 1.0, 1.5, and 2.0) solder alloys consisted of a β-Sn solid solution, Ni3Sn4 phase, and Cu6Sn5 phase. The volume fraction of Ni3Sn4 increased with increasing Ni content. The addition of Ni increased the solidus and liquidus temperatures of the Sn-0.7Cu-xNi solder alloys. However, the melting range of the Sn-0.7Cu-0.5Ni and Sn-0.7Cu-1.0Ni solder alloys is lower than that of the Sn-0.5Cu solder alloy. The spreading area of the Sn-0.7Cu-xNi solder alloy first increased and then decreased with increasing Ni content. Moreover, the ultimate tensile strength and hardness of the Sn-0.7Cu-xNi solder alloy increased gradually with increasing Ni content. The Sn-0.7Cu-2.0Ni alloy has maximum ultimate tensile strength and hardness values of 52.01 MPa and 16.45 Hv, respectively. However, the electrical conductivity of the Sn-0.7Cu-xNi solder alloy decreased with increasing Ni content. These changes in performance related to the formation of the intermetallic Ni3Sn4 phase. The Sn-0.7Cu-1.0Ni solder alloy had the best comprehensive performance in the present experiment. For the Sn-0.7Cu-1.0Ni solder alloy, the expanded area was 1.28 times that of the Sn-0.7Cu alloy, and the liquidus temperature, melting range, strength, hardness, and resistivity of the alloy solder were at the intermediate level among the Sn-0.7Cu-xNi solder alloys. Therefore, the Sn-0.7Cu-1.0Ni alloy is a relatively ideal solder alloy with a good comprehensive performance among the Sn-0.7Cu-xNi solder alloys.
Vorheriger Artikel Effect of Tensile Mean Strain on Fatigue Behavior of Al-Li Alloy 2099
Nächster Artikel Evaluation of Microstructure and Mechanical Properties of Explosive-Welded HSLA/304L Steel Bimetallic Plates

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Metadaten
Titel
Effect of Ni Content on the Microstructure Formation and Properties of Sn-0.7Cu-xNi Solder Alloys
verfasst von
Jianglei Fan
Hengtao Zhai
Zhanyun Liu
Xiao Wang
Ying Li
Hongxia Gao
Jianxiu Liu
Publikationsdatum
03.08.2020
Verlag
Springer US
Erschienen in
Journal of Materials Engineering and Performance / Ausgabe 8/2020
Print ISSN: 1059-9495
Elektronische ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-020-04996-3

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