Skip to main content
Fachgebiete
Automobil + Motoren Bauwesen + Immobilien Business IT + Informatik Elektrotechnik + Elektronik Energie + Nachhaltigkeit Finance + Banking Management + Führung Marketing + Vertrieb Maschinenbau + Werkstoffe Versicherung + Risiko
DE
EN
Bücher
Zeitschriften
Themenseiten
Organisationspsychologie Projektmanagement Marketing Smart Manufacturing
Weitere Formate
Podcasts Webinare Technik Webinare Wirtschaft Kongresse Veranstaltungskalender Awards
Jetzt Einzelzugang starten
Zugang für Unternehmen
Referenzkunden
SLX-Digitalkonferenz: Zukunftswerkstatt 2024

Mehr Umsatz mit Top-Kontakten

Am 7. Mai erfahren Sie, wie Vertriebsteams Leadgenerierung, Leadnurturing und Leadstrategien effizient steuern können.
Erweiterte Suche
Anmelden
nach oben
Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 6/2015

01.06.2015

Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders

verfasst von: C. H. Huang, Chin-Hsin Chen, S. Y. Chang, L. C. Tsao, R. S. Chen

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2015

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The effects of TiO2 nanoparticles and cooling rate on the microstructure and mechanical properties of Sn1.5Sb0.7Cu alloy were investigated. A higher cooling rate and TiO2 nanoparticles refined the primary β-Sn dendrites, Cu6Sn5 and SbSn phase. Especially, the microstructure of the Sn1.5Sb0.7Cu composite solders under the rapid-cooled condition exhibited fine dot-like Cu6Sn5 in the eutectic regions. The improvement in strength was mostly attributed to (1) refinement of the β-Sn grain size; (2) the Orowan strengthening effect; (3) CTE mismatch between reinforcement second phase particles (Cu6Sn5 and TiO2) and the matrix; and (4) the load-bearing effect. However, the total elongation of the composite solders was observed to decrease because of micro-voids both at and along the Cu6Sn5 grain boundary regions. The fracture surfaces of all Sn1.5Sb0.7Cu composite solder were confirmed to exhibit the ductile fracture mode.
Vorheriger Artikel Synthesis and optical characterization of Pb(Zr0.53Ti0.47)O3 thin films on indium tin oxide/quartz substrates by a simplified sol–gel route
Nächster Artikel Improving quality factor of Nd2MoO6 ceramics by removing moisture content

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Jetzt informieren
Literatur
1.
K.N. Tu, K. Zeng, Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1–58 (2001)CrossRef
2.
L.C. Tsao, R.W. Wu, T.H. Cheng, K.H. Fan, R.S. Chen, Effects of nano-Al2O3 particles on microstructure and mechanical properties of Sn3.5Ag0.5Cu composite solder ball grid array joints on Sn/Cu pads. Mater. Des. 50, 774–781 (2013)CrossRef
3.
H.J. Lin, T.H. Chuang, Interfacial microstructure and bonding strength of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–XZn solder BGA packages with immersion Ag surface finish. Microelectron. Reliab. 51, 445–452 (2011)CrossRef
4.
L.C. Tsao, C.P. Chu, S.F. Peng, Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate. Microelectron. Eng. 88, 2964–2969 (2011)CrossRef
5.
C.L. Chuang, L.C. Tsao, H.K. Lin, L.P. Feng, Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder. Mater. Sci. Eng. A 558, 478–484 (2012)CrossRef
6.
K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints. J. Alloys Compd. 352, 226–236 (2003)CrossRef
7.
W.M. Xiao, Y.W. Shi, Y.P. Lei, Z.D. Xia, F. Guo, Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys. J. Electron. Mater. 35, 1095–1103 (2006)CrossRef
8.
L. Zhang, K.N. Tu, Structure and properties of lead-free solders bearing micro and nano particles. Mater. Sci. Eng. R 82, 1–32 (2014)CrossRef
9.
L.C. Tsao, S.Y. Chang, Effects of nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder. Mater. Des. 31, 990–993 (2010)CrossRef
10.
L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Chiang, Effects of Nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder. Mater. Des. 31, 4831–4835 (2010)CrossRef
11.
J. Shen, Y.C. Liu, D.J. Wang, H.X. Gao, Nano ZrO2 particulate-reinforced lead-free solder composite. J. Mater. Sci. Technol. 22, 529–532 (2006)CrossRef
12.
A.A. El-Daly, A. Fawzy, S.F. Mansour, M.J. Younis, Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance. Mater. Sci. Eng. A 578, 62–71 (2013)CrossRef
13.
A.A. El-Daly, A. Fawzy, S.F. Mansour, M.J. Younis, Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles. J. Mater. Sci.: Mater. Electron. 24, 2976–2988 (2013)
14.
Y. S. Park, Y. M. Kwon, H. Y. Son, J. T. Moon, Effect of Sb addition in Sn–Ag–Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish. In: Electronic Material and Packaging, 2007
15.
A.A. El-Daly, A.E. Hammad, A. Fawzy, D.A. Nasrall, Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions. Mater. Des. 43, 40–49 (2013)CrossRef
16.
H.S. Güdera, E. Şahina, O. Şahina, H. Göçmezb, C. Duranc, Vickers and Knoop Indentation Microhardness Study of β-SiAlON Ceramic. Acta Phys. Pol. A 120, 1026–1033 (2011)
17.
T.H. Chuang, L.C. Tsao, C.H. Chung, S.Y. Chang, Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging. Mater. Des. 39, 475–483 (2012)CrossRef
18.
A.R. Geranmayeh, R. Mahmudi, M. Kangooie, High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder. Mater. Sci. Eng. A 528, 3967–3972 (2011)CrossRef
19.
T. Fouzder, I. Shafiq, Y.C. Chan, A. Sharif, W.K.C. Yung, Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads. J. Alloys Compd. 509, 1885–1892 (2011)CrossRef
20.
A.A. El-Daly, T.A. Elmosalami, W.M. Desoky, M.G. El-Shaarawy, A.M. Abdraboh, Tensile deformation behavior and melting property of nano-sized ZnO particles reinforced Sn–3.0Ag–0.5Cu lead-free solder. Mater. Sci. Eng. A 17, 389–3973 (2014)CrossRef
21.
C.C. Jain, T.H. Chuang, L.P. Feng, L.C. Tsao, Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder. Mater. Des. 32, 4720–4727 (2011)CrossRef
22.
L.C. Tsao, Suppressing effect of 0.5 wt% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging. J. Alloys Compd. 509, 8441–8448 (2011)CrossRef
23.
L.C. Tsao, Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering. J. Alloys Compd. 509, 2326–2333 (2011)CrossRef
24.
X.L. Zhong, M. Gupta, Development of lead-free Sn–0.7Cu/Al2O3 nanocomposite solders with superior strength. J. Phys. D: Appl. Phys. 41, 095403–095409 (2008)CrossRef
25.
J. Shen, Y.C. Chan, Effects of ZrO2 nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads. J. Alloys Compd. 477, 552–559 (2009)CrossRef
26.
E.S. Gouda, Effect of cooling rate on structure and creep behavior of Sn0.7Cu0.5Zn lead-free solder alloy. Eur. Phys. J. Appl. Phys. 48, 20902–20906 (2009)CrossRef
27.
J.M. Song, J.J. Lin, C.F. Huang, H.Y. Chuang, Crystallization, morphology and distribution of Ag3Sn in Sn–Ag–Cu alloys and their influence on the vibration fracture properties. Mater. Sci. Eng. A 466, 9–17 (2007)CrossRef
28.
L.C. Tsao, An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate. Mater. Sci. Eng. A 529, 41–48 (2011)CrossRef
29.
W.D. Callister, Fundamentals of Materials Science and Engineering, 2nd edn. (Wiley, New York, 2004), p. 252
30.
I. Shao, P.M. Verrcken, C.L. Chien, P.C. Searson, R.C. Cammarata, Synthesis and characterization of particle-reinforced Ni/Al2O3 nanocomposite. J. Mater. Res. 17, 1412–1418 (2002)CrossRef
31.
L. Thilly, M. Veron, O. Ludwig, F. Lecourterier, Deformation mechanism in high strength Cu/Nb nanocomposites. Mater. Sci. Eng. A 309–310, 510–513 (2001)CrossRef
32.
G.E. Dieter, Mechanical Metallurgy, 3rd edn. (McGraw-Hill, New York, 1986), p. 325
33.
Q. Zhang, D.L. Chen, A model for predicting the particle size dependence of the low cycle fatigue life in discontinuously reinforced MMCs. Scr. Mater. 51, 863–867 (2004)CrossRef
34.
L.H. Dai, Z. Ling, Y.L. Bai, Size-dependent inelastic behavior of particle-reinforced metal-matrix composites. Compos. Sci. Technol. 61, 1057–1063 (2001)CrossRef
35.
Z. Zhang, D.L. Chen, Contribution of Orowan strengthening effect in particulate-reinforced metal matrix nanocomposites. Mater. Sci. Eng. A 483–484, 148–152 (2008)CrossRef
36.
M. Cadek, J.N. Coleman, V. Barron, K. Hedicke, W.J. Blau, Mechanical properties and morphology of carbon nanotube reinforced semi crystalline and amorphous polymer composites. Appl. Phys. Lett. 81, 5123–5125 (2002)CrossRef
37.
S.M.L. Nai, J. Wei, M. Gupta, Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes. Mater. Sci. Eng. A 423, 166–169 (2006)CrossRef
Metadaten
Titel
Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders
verfasst von
C. H. Huang
Chin-Hsin Chen
S. Y. Chang
L. C. Tsao
R. S. Chen
Publikationsdatum
01.06.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-2860-3

Weitere Artikel der Ausgabe 6/2015

Journal of Materials Science: Materials in Electronics 6/2015 Zur Ausgabe

OriginalPaper

Effect of Tb substitution on structural, optical, electrical and magnetic properties of BiFeO3

OriginalPaper

Structural and electrical properties of BiFeO3–PbTiO3 system

OriginalPaper

Synthesis, microstructure, and luminescence properties of 3C-SiC powders

OriginalPaper

Ultraviolet nano-photodetector based on ZnS:Cl nanoribbon/Au Schottky junctions

OriginalPaper

Structural property and optical band edge of Ag(In0.5Al0.5)S2

OriginalPaper

MnS thin films prepared by a simple and novel nebulizer technique: report on the structural, optical, and dispersion energy parameters

Neuer Inhalt

    Bildnachweise