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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 11/2012

01.11.2012

Effect of Zn on properties and microstructure of SnAgCu alloy

verfasst von: Liang Zhang, Ji-guang Han, Cheng-wen He, Yong-huan Guo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 11/2012

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Abstract

The microstructures, wettabilities and mechanical properties of SnAgCu-xZn (x = 0, 0.5, 0.8, 1.0, 1.2, 2.0, 2.5, 3.0) solders were investigated, respectively. The results indicated that adding small amount of Zn can evidently improve the wettability, mechanical properties and refine the microstructure of SnAgCu lead-free solder. However, there existed an effective range for the Zn addition, the best Zn content was found to be 0.8 % in the current study. Moreover, the presence of Zn in the solders plays a major role in inhibiting the growth of Cu–Sn intermetallic layer in the solder/Cu interface. Based on thermal-cycling tests, it is demonstrated that the addition of Zn can enhance the thermal-fatigue properties of SnAgCu solder joints.
Vorheriger Artikel Electromagnetic properties of phosphate-coated ferrite composite materials
Nächster Artikel Fabrication of Cu(In,Ga)Se2 thin films by ion beam sputtering deposition from a quaternary target at different substrate temperatures

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Metadaten
Titel
Effect of Zn on properties and microstructure of SnAgCu alloy
verfasst von
Liang Zhang
Ji-guang Han
Cheng-wen He
Yong-huan Guo
Publikationsdatum
01.11.2012
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 11/2012
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-012-0686-9

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