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Erschienen in:
10.08.2016
Engineering functionalized PS/mSiO2 composite particles with controlled meso-shell thickness for chemical mechanical planarization applications
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1/2017
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Abstract
The functionalized PS/mSiO2 composite particles (CPs), featuring polystyrene cores and mesoporous silica shells, were introduced into chemical mechanical planarization (CMP) processes. The PS/mSiO2 CPs presented a higher material removal rate (MRR) and a lower root-mean-square (RMS) roughness than conventional solid silica particles. The MRR (48–75 nm/min) and RMS roughness (0.16–0.26 nm) of the finished oxidized silicon wafers decreased as the shell thickness (30–50 nm) reduced. The reduced RMS roughness was attributed to their relatively low hardness and modulus. The enhanced MRR resulted from their strong adsorptivity for the active components in slurries. The non-damage surfaces were efficiently achieved from the synergetic effect of the non-rigid mechanical properties and the enhanced chemical reactivity in the interfaces between PS/mSiO2 CPs and substrates.