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Erschienen in: Microsystem Technologies 3-4/2007

01.02.2007 | Technical paper

Fabrication of a spiral microcoil using a 3D-LIGA process

verfasst von: Harutaka Mekaru, Shinji Kusumi, Noriaki Sato, Masami Shimizu, Michiru Yamashita, Osamu Shimada, Tadashi Hattori

Erschienen in: Microsystem Technologies | Ausgabe 3-4/2007

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Abstract

LIGA processes have been developed generally in the 2.5D world. We introduced techniques of 3D X-ray lithography and worm injection molding with a unscrewing release mechanism, and succeeded in the development to three dimensions of LIGA process. We called this technology 3D-LIGA process, and came to be able to fabricate the plastic molded product with a spiral microstructure. Furthermore, we succeeded in the trial production of a spiral microcoil using 3D-LIGA process and metallization technique combining flat and smooth electroplating with a leveling agent and an isotropic chemical etching. The diameter of this microcoil was 0.5 mm and the length was 1 mm. The width of the Cu coil line was 10 μm, and the pitch was 20 μm. Moreover, we measured characteristics of this microcoil as an inductor. The inductance and the quality factor at the frequency of 1 GHz were 91 nH and 5.8, respectively. This is the first time successful fabrication of an electric device with a 3D form like a spiral microcoil using the 3D-LIGA process has been achieved.

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Metadaten
Titel
Fabrication of a spiral microcoil using a 3D-LIGA process
verfasst von
Harutaka Mekaru
Shinji Kusumi
Noriaki Sato
Masami Shimizu
Michiru Yamashita
Osamu Shimada
Tadashi Hattori
Publikationsdatum
01.02.2007
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 3-4/2007
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0202-3

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