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Erschienen in: Journal of Materials Science: Materials in Electronics 19/2018

31.07.2018

Forward and reverse bias current–voltage (I–V) characteristics in the metal–ferroelectric–semiconductor (Au/SrTiO3/n-Si) structures at room temperature

verfasst von: A. Buyukbas-Ulusan, S. Altındal-Yerişkin, A. Tataroğlu

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 19/2018

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Abstract

The main electrical parameters of fabricated Au/SrTiO3/n-Si (MFS) structures have been investigated by using various methods. The values of ideality factor (n) and zero-bias barrier height (ΦB0) are calculated from the forward bias current–voltage (IF–VF) data as 0.60, and 0.48 eV from thermionic theory (TE) and Cheung functions, respectively. The value of Rs is also obtained from the Norde function and Cheung functions as 87.83 and 137.57 Ω, respectively. The discrepancy between these results can be attributed to the calculated method and the measured voltage range. Besides, the energy density distribution profile of interface state (Nss) was obtained from the (IF–VF) data by taking into account voltage dependent barrier height (BH), n and without Rs. On the other hand, the possible current conduction mechanism (CCM) are determined by utilizing the In(IF) versus In(VF) and In(IR) versus VR1/2 plots. The double logarithmic IF–VF plot shows three linear regions which are corresponding to low, moderate and high bias voltages with different slopes (m) as 2.40, 1.96 and 1.27 respectively. While the first region space charge limited current (SCLC) is dominated, the other two regions ohmic behavior is dominated. The field-lowering coefficient (β) was also obtained from the slope of In(IR)–V1/2 plot as 4.40 \(\times\) 10−6 eV−1 m1/2 V1/2. This value of β is close to theoretical value of Poole–Frenkel emission (PFE) rather than Schottky emission (SE) mechanism.

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Metadaten
Titel
Forward and reverse bias current–voltage (I–V) characteristics in the metal–ferroelectric–semiconductor (Au/SrTiO3/n-Si) structures at room temperature
verfasst von
A. Buyukbas-Ulusan
S. Altındal-Yerişkin
A. Tataroğlu
Publikationsdatum
31.07.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 19/2018
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9767-8

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