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Erschienen in: Journal of Materials Science: Materials in Electronics 2/2016

31.10.2015

Influence of B2O3–SiO2–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic

verfasst von: Jun Chen, De’an Yang, Tong Zhai, Bingqiang Gui, Qi Wang

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 2/2016

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Abstract

In this study, B2O3–SiO2–ZnO–BaO (BSZB) glass-coated copper particles were prepared by sol–gel process for use in copper pastes. The pastes with different ratio of BSZB glass were sintered at temperatures ranging from 850 to 910 °C with low temperature co-fired ceramic (LTCC) substrate. When pastes prepared from 1 wt% glass-coated copper powder were sintered at 910 °C, both a dense copper film and a dense LTCC structure were obtained. At this condition, the film had a thickness of approximately 15 μm and a sheet resistance of 1.9 mΩ/□, and a good bonding behavior between copper film and LTCC substrate was also observed.

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Metadaten
Titel
Influence of B2O3–SiO2–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic
verfasst von
Jun Chen
De’an Yang
Tong Zhai
Bingqiang Gui
Qi Wang
Publikationsdatum
31.10.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 2/2016
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-3975-2

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