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Journal of Materials Science: Materials in Electronics

Erschienen in:

04.06.2021

Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

verfasst von: Hongyu Qiu, Han Xu, Chuge Zhang, Xiaowu Hu, Xiongxin Jiang, Qinglin Li

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 13/2021

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Abstract

The influence of solid–liquid electromigration on Cu-xCo/Sn-3.0Ag-0.5Cu/Cu-xCo (x = 0, 30 and 50 wt.%) joints bonded at 260 °C with electric density of 2.89 × 10² A/cm² for 10 h was investigated. The experiment revealed that the (Cu,Co)₆Sn₅ intermetallic compound (IMC) was dominant phase in bonding joints with the addition of Co. Besides, the lamellate (Co,Cu)Sn₂ grains nucleated around the Co-rich phases. Additionally, the current direction was at an angle to the orientation of prismatic (Cu,Co)₆Sn₅ grain [100] direction compared to that of the Cu₆Sn₅ [100] direction aligned with the electric current direction. The analysis results of nanoindentation show that the hardness and the Young’s modulus increased with the Co content in the substrates. Moreover, the additional Co caused the refinement of IMCs grain and the improvement of tensile strength of solder joints.

Vorheriger Artikel Electrophoretic deposition of CuO particulate thick film for ethanol sensing

Nächster Artikel Effect of vanadium and tin additives on structural and magnetic properties of Bi-YIG nano-particles

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Titel: Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
verfasst von: Hongyu Qiu
Han Xu
Chuge Zhang
Xiaowu Hu
Xiongxin Jiang
Qinglin Li
Publikationsdatum: 04.06.2021
Verlag: Springer US
Erschienen in: Journal of Materials Science: Materials in Electronics / Ausgabe 13/2021
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-021-06256-z

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