Ausgabe 11/2003
Inhalt (35 Artikel)
Foreword
S. -W. Chen, H. M. Lee, D. Swenson, C. R. Kao, S. E. Mohney, M. R. Notis, R. Schmid-Fetzer
Ni, Pd, or Pt as contact materials for GaSb and InSb semiconductors: Phase diagrams
Herbert Ipser, Klaus W. Richter
Effects of doping on the high-temperature thermoelectric properties of IrSb3 skutterudite compounds
Sung Wng Kim, Yoshisato Kimura, Yoshinao Mishima
Influences of ZnO buffer layers on the quality of ZnO films synthesized by the metal-organic chemical vapor deposition process
Sun-Hong Park, Chul-Hwan Choi, Kyoung-Bo Kim, Seon-Hyo Kim
Paramagnetic-to-antiferromagnetic phase transformation in sputter-deposited Ni-Mn thin films
Peter F. Ladwig, Ying Yang, Ling Ding, I-Fei Tsu, Y. Austin Chang
The effects of quaternary additions on thermoelectric properties of TiNiSn-based half-heusler alloys
Takahiro Katayama, Sung Wng Kim, Yoshisato Kimura, Yoshinao Mishima
Planar defects and double-domain epitaxy in epitaxial YSi2−x and ErSi2−x thin films on Si substrates
W. C. Tsai, K. S. Chi, L. J. Chen
High-resolution transmission electron microscopy of silicide formation and morphology development of Ni/Si and Ni/Si1−xGex
X. Chen, Z. Shi, S. K. Banerjee, J. P. Zhou, L. K. Rabenberg
The effect of Pd and Cu in the intermetallic growth of alloy Au wire
Hen-So Chang, Ker-Chang Hsieh, Theo Martens, Albert Yang
Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems
Sinn-Wen Chen, Shyr-Harn Wu, Shou-Wei Lee
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
Jeong-Won Yoon, Chang-Bae Lee, Seung-Boo Jung
A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
J. Y. Tsai, Y. C. Hu, C. M. Tsai, C. R. Kao
Intermetallic growth between lead-free solders and palladium
Gaurav Sharma, C. M. Eichfeld, S. E. Mohney
Effect of Cu content on interfacial reactions between Sn(Cu) alloys and Ni/Ti thin-film metallization
S. C. Hsu, S. J. Wang, C. Y. Liu
Electromigration study in SnAg3.8Cu0.7 solder joints on Ti/Cr-Cu/Cu under-bump metallization
Ying-Chao Hsu, Tung-Liang Shao, Ching-Jung Yang, Chih Chen
Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint
Jong Hoon Kim, Sang Won Jeong, Hyun Deuk Kim, Hyuck Mo Lee
Sputtered copper films with insoluble Mo for Cu metallization: A thermal annealing study
C. H. Lin, J. P. Chu, T. Mahalingam, T. N. Lin, S. F. Wang
Formation and growth of intermetallics around metallic particles in eutectic Sn-Ag solder
J. G. Lee, K. C. Chen, K. N. Subramanian
Interfaces in lead-free soldering
Chi-Won Hwang, Keun-Soo Kim, Katsuaki Suganuma
Effects of intermetallic morphology at the metallic particle/solder interface on mechanical properties of Sn-Ag-based solder joints
H. Rhee, F. Guo, J. G. Lee, K. C. Chen, K. N. Subramanian
Thermodynamic database on microsolders and copper-based alloy systems
X. J. Liu, I. Ohnuma, C. P. Wang, M. Jiang, R. Kainuma, K. Ishida, M. Ode, T. Koyama, H. Onodera, T. Suzuki
Interfacial reactions and compound formation in the edge of PbSn flip-chip solder bumps on Ni/Cu under-bump metallization
Chien-Sheng Huang, Guh-Yaw Jang, Jeng-Gong Duh
Electromigration studies of flip chip Sn95/Sb5 solder bumps on Cr/Cr-Cu/Cu under-bump metallization
T. L. Shao, K. C. Lin, Chih Chen
Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints
Sinn-Wen Chen, Shou-Wei Lee, Ming-Chuen Yip
Thermodynamic modeling of the Au-In-Sn system
H. S. Liu, C. L. Liu, K. Ishida, Z. P. Jin
Phase equilibria studies of Sn-Ag-Cu eutectic solder using differential cooling of Sn-3.8Ag-0.7Cu alloys
Jae-Yong Park, Choong-Un Kim, Ted Carper, Viswanadham Puligandla
Study of interaction between Cu-Sn and Ni-Sn interfacial reactions by Ni-Sn3.5Ag-Cu sandwich structure
S. J. Wang, C. Y. Liu
Effects of prestrain, rate of prestrain, and temperature on the stress-relaxation behavior of eutectic Sn-3.5Ag solder joints
H. Rhee, K. N. Subramanian
A simple single-step diffusion and emitter etching process for high-efficiency gallium-antimonide thermophotovoltaic devices
G. Rajagopalan, N. S. Reddy, H. Ehsani, I. B. Bhat, P. S. Dutta, R. J. Gutmann, G. Nichols, O. Sulima
Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometry
Baik-Woo Lee, Ju-Young Kim, Dongil Kwon
Edge-emitting electroluminescence polarization investigation of InGaN/GaN light-emitting diodes grown by metal-organic chemical vapor deposition on sapphire (0001)
D. I. Florescu, D. S. Lee, S. M. Ting, J. C. Ramer, E. A. Armour
Improved area density and luminescence properties of InP quantum dots grown on In0.5Al0.5P by metal-organic chemical vapor deposition
X. B. Zhang, R. D. Heller, M. S. Noh, R. D. Dupuis, G. Walter, N. Holonyak Jr.
High-quality crystalline layer transfer from a silicon-on-insulator substrate onto a sapphire substrate using wafer bonding
D. V. Singh, L. Shi, K. W. Guarini, P. M. Mooney, S. J. Koester, A. Grill
Semiconductor nanowires surrounded by cylindrical Al2O3 shells
Byungdon Min, Jong Soo Lee, Kyoungah Cho, Ju Won Hwang, Hyunsuk Kim, Man Young Sung, Sangsig Kim, Jeunghee Park, Hee Won Seo, Seung Yong Bae, Moon-Sook Lee, Soon Oh Park, Joo-Tae Moon
Self-aligned Ti germanosilicide formation on a polycrystalline Si/SiGe/Si extrinsic base for SiGe heterojunction bipolar transistors
Seung-Yun Lee, Chan Woo Park, Jin-Yoeng Kang