Ausgabe 3/2014
Special Section: Mechanical Reliability of Electronic Components; Guest Editor: Narayanaswami Ranganathan
Inhalt (20 Artikel)
Structure–Diffusion Relationship of Magnetron-Sputtered WTi Barriers Used in Indium Interconnections
A. Le Priol, E. Le Bourhis, P.-O. Renault, P. Muller, H. Sik
Architectured Materials to Improve the Reliability of Power Electronics Modules: Substrate and Lead-Free Solder
Abderrahmen Kaabi, Yves Bienvenu, David Ryckelynck, Bertrand Pierre
Local and Global Properties of a Lead-Free Solder
Z. Ma, F. Chalon, R. Leroy, N. Ranganathan, B.D. Beake
Three-Dimensional Thermomechanical Simulation of Fine-Pitch High-Count Ball Grid Array Flip-Chip Assemblies
W. Kpobie, N. Bonfoh, C. Dreistadt, M. Fendler, P. Lipinski
Mechanical and Electrical Reliability Assessment of Stacking of Ultrathin Chips on Si Interposer Using Back-to-Face Architecture
G. Parès, F. De Crecy, R. Anciant
Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation’s Element of a New Electronic Component
W. Rmili, M.P. Deffarges, F. Chalon, Z. Ma, R. Leroy
3D FEM Simulations of Drop Test Reliability on 3D-WLP: Effects of Solder Reflow Residual Stress and Molding Resin Parameters
Soufyane Belhenini, Abdellah Tougui, Abdelhake Bouchou, Ranganathan Mohan, Franck Dosseul
Indentation Creep of Lead-Free Sn-5Sb Solder Alloy with 1.5 wt% Ag and Bi Additions
A.R. Geranmayeh, R. Mahmudi, F. Khalatbari, N. Kashi, G. Nayyeri
Effects of Annealing Temperature on the Electric Properties of 0.94(Na0.5Bi0.5)TiO3–0.06BaTiO3 Ferroelectric Thin Film
J. F. Peng, X. J. Zheng, Y. Q. Gong, K. Zhan, Z. H. Dai
Structural, Dielectric, and Electrical Properties of BiFeWO6 Ceramic
Jyoshna Rout, B.N. Parida, Piyush R. Das, R. N. P. Choudhary
Strong Enhancement of Near-Band-Edge Photoluminescence of ZnO Nanowires Decorated with Sputtered Metallic Nanoparticles
Mohsen Purahmad, Michael A. Stroscio, Mitra Dutta
Thermal Conductivity Measurement of Low-k Dielectric Films: Effect of Porosity and Density
M. T. Alam, R. A. Pulavarthy, J. Bielefeld, S. W. King, M. A. Haque
Investigation of Structural and Electrical Properties of B-Site Complex Ion (Mg1/3Nb2/3)4+-Modified High-Curie-Temperature BiFeO3-BaTiO3 Ceramics
Xiujuan Zhou, Changrong Zhou, Qin Zhou, Huabin Yang, Zhenyong Cen, Jun Cheng, Lei Cao, Qiaolan Fan
Substitutional Atom Influence on the Electronic and Transport Properties of Mn4Si7
Ali Allam, Pascal Boulet, Marie-Christine Record
Pressure-Free Bonding of Metallic Plates with Ni Affinity Layers Using Cu Nanoparticles
Toshitaka Ishizaki, Kunio Akedo, Toshikazu Satoh, Ryota Watanabe
High Performance Bottom-Gate-Type Amorphous InGaZnO Flexible Transparent Thin-Film Transistors Deposited on PET Substrates at Low Temperature
Hsin-Ying Lee, Wan-Yi Ye, Yung-Hao Lin, Li-Ren Lou, Ching-Ting Lee
Reduction of Dislocation Density in HVPE-Grown GaN Epilayers by Using In Situ-Etched Porous Templates
Z. D. Zhao, B. Wang, Y. P. Sui, W. Xu, X. L. Li, G. H. Yu
p-on-n HgCdTe Infrared Focal-Plane Arrays: From Short-Wave to Very-Long-Wave Infrared
L. Mollard, G. Bourgeois, C. Lobre, S. Gout, S. Viollet-Bosson, N. Baier, G. Destefanis, O. Gravrand, J. P. Barnes, F. Milesi, A. Kerlain, L. Rubaldo, A. Manissadjian