Ausgabe 8/2008
Inhalt (19 Artikel)
Overshoot Graded Layers for Mismatched Heteroepitaxial Devices
J.F. Ocampo, E. Suarez, F.C. Jain, J.E. Ayers
Electrical Characteristics and Photoresponse of ZnO/ZnTe Heterojunction Diodes
W. Wang, A. Lin, J.D. Phillips
Optical Properties of Nanocrystalline GaN Films Prepared by Annealing Amorphous GaN in Ammonia
Z.X. Zhang, X.J. Pan, T. Wang, L. Jia, L.X. Liu, W.B. Wang, E.Q. Xie
MOCVD Growth of InN on Si(111) with Various Buffer Layers
C.C. Huang, R.W. Chuang, S.J. Chang, J.C. Lin, Y.C. Cheng, W.J. Lin
Polarity Analysis of Self-Seeded Aluminum Nitride Crystals Grown by Sublimation
Qifeng Han, Chenghong Duan, Changjian Ji, Kai Qiu, Fei Zhong, Xinhua Li, Zhijun Yin, Xiancun Cao, Xiuju Zhou, Yuqi Wang
Characterization of Mg-Doped AlInN Annealed in Nitrogen and Oxygen Ambients
A.T. Cheng, Y.K. Su, W.C. Lai, Y.Z. Chen, S.Y. Kuo
Growth of GaN Nanowires on Epitaxial GaN
D. Aurongzeb, D.Y. Song, G. Kipshidze, B. Yavich, L. Nyakiti, R. Lee, J. Chaudhuri, H. Temkin, M. Holtz
Field-Emission Performance of Wormhole-Like Mesoporous Tungsten Oxide Nanowires
Wei Hao Lai, Min Hsiung Hon, Lay Gaik Teoh, Yen Hsun Su, Jiann Shieh, Chu Kun Chen
Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking
W. Zhang, W. Ruythooren
Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions
Ja-Young Jung, Shin-Bok Lee, Ho-Young Lee, Young-Chang Joo, Young-Bae Park
Intermetallics Characterization of Lead-Free Solder Joints under Isothermal Aging
Anupam Choubey, Hao Yu, Michael Osterman, Michael Pecht, Fu Yun, Li Yonghong, Xu Ming
Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects
Seungbae Park, Ramji Dhakal, Jia Gao
Characterization of Self-Formed Ti-Rich Interface Layers in Cu(Ti)/Low-k Samples
Kazuyuki Kohama, Kazuhiro Ito, Susumu Tsukimoto, Kenichi Mori, Kazuyoshi Maekawa, Masanori Murakami
Evaluation of Mn Uniformity in CdMnTe Crystal Grown by the Vertical Bridgman Method
Jijun Zhang, Wanqi Jie, Lijun Luan, Tao Wang, Dongmei Zeng
Ambient Temperature Ultrasonic Bonding of Si-Dice Using Sn-3.5wt.%Ag
Jung-Mo Kim, Jae-Pil Jung, Y. Norman Zhou, Jong-Hyeong Kim