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Journal of Materials Science: Materials in Electronics

Ausgabe 7/1999

Inhalt (17 Artikel)

A robust low cost thick film system for the consumer market

S. Achmatowicz, M. Jakubowska, E. Zwierkowska, K. Pitt, M. Primovich

Photoelectronic properties of (Cu, Fe, Al) incorporated CdS thin films

H. H. Afify, I. K. El Zawawi, I. K. Battisha

High-quality n-Si/i-p+-i SiGe/n-Si structure grown by ultra high vacuum chemical molecular epitaxy

Jinshu Zhang, Hongyong Jia, Peiyi Chen, Pei-Hsin Tsien, M. X. Feng, Q. Y. Lin, Tai-Chin Lo

The fabrication of microrelief structures in evaporated Ag/a-Ge30S70 layers

J. Eneva, A. Gushterov, B. Tomerova, B. Mednikarov

Effect of microstructure on degradation of AlN films prepared by ion beam assisted deposition

Yoshifumi Sakuragi, Yoshihisa Watanabe, Yoshiki Amamoto, Yoshikazu Nakamura

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