Extreme wire electrical discharge machining based on semiconductor characteristics

To meet the increasing demand for wire electrical discharge machining (WEDM) under extreme conditions such as ultra-high thickness cutting, micro-wire cutting, micro-energy finishing, and ceramic composites machining, a concept of multichannel discharge WEDM under semiconductor characteristics was proposed. The essence of this conception is that under these extreme machining conditions, the electrode wire or workpiece — or even both of the two electrodes — cannot be treated as electrically conductive materials of the conventional WEDM due to their high electrical resistance. However, they can exhibit electrical discharge behavior like semiconductors, which is defined as semiconductor characteristics. The conventional WEDM theory and related technologies cannot be applied to extreme WEDM because conventional WEDM only has one discharge channel per pulse, whereas multiple discharge channels can be generated by each pulse in extreme WEDM. Therefore, a suitable theory needs to be developed for extreme WEDM under semiconductor characteristics. Based on the multichannel discharge behavior of semiconductors, experiments were conducted on high-efficiency machining with multichannel discharge by stacking several workpieces as an assembly with semiconductor characteristics. It was proved that the multichannel discharge WEDM is capable of achieving high machining efficiency, as well as enhanced surface quality and lower wear of electrode wire. The proposed multichannel discharge WEDM sets up the foundation for the establishment of the theoretical system of EDM under semiconductor characteristics.