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Erschienen in: Microsystem Technologies 3-4/2007

01.02.2007 | Technical Paper

Fabrication of a polymeric tapered HARMs array utilizing a low-cost nickel electroplated mold insert

verfasst von: In-Hyouk Song, Yoonyoung Jin, Pratul K. Ajmera

Erschienen in: Microsystem Technologies | Ausgabe 3-4/2007

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Abstract

A simple low-cost technique has been developed to fabricate a mold insert for replicating polymeric tapered high aspect ratio microstructures. A backside exposure technique is used to first obtain a tapered sidewall structure as an electroplating mold in SU-8 photoresist on a glass wafer. Nickel electroplating is utilized to form the mold insert. The lowest average surface roughness of the nickel mold insert on the side that interfaces with the glass wafer during electroplating is measured to be 7.02 nm. A novel technique involving use of titanium putty is introduced here to reduce cost and effort required to fabricate the mold insert. Replication of tapered microstructures in polymeric materials utilizing the fabricated mold insert is demonstrated here in polydimethylsiloxane by a direct molding process and in polymethyl methacrylate by hot embossing. The fabrication details for the mold insert are described. Advantages and disadvantages of the use of titanium putty for achieving superior metal surface finish are given.

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Literatur
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Zurück zum Zitat Despont M, Lorenz H, Fahrni N, Brugger J, Renaud P, Vettiger P (1997) High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications. In: Micro Electro Mechanical Systems, 1997, MEMS ‘97, Proceedings IEEE, 10th annual international workshop, 26–30 January 1997, pp. 518–522 Despont M, Lorenz H, Fahrni N, Brugger J, Renaud P, Vettiger P (1997) High-aspect-ratio, ultrathick, negative-tone near-uv photoresist for MEMS applications. In: Micro Electro Mechanical Systems, 1997, MEMS ‘97, Proceedings IEEE, 10th annual international workshop, 26–30 January 1997, pp. 518–522
Zurück zum Zitat Kim K, Park DS, Lu HM, Che W, Kim K, Lee JB, Ahn CH (2004) A tapered hollow metallic microneedle array using backside exposure of SU-8. J Micromech Microeng 14:597–603CrossRef Kim K, Park DS, Lu HM, Che W, Kim K, Lee JB, Ahn CH (2004) A tapered hollow metallic microneedle array using backside exposure of SU-8. J Micromech Microeng 14:597–603CrossRef
Zurück zum Zitat Peterman MC, Huie P, Bloom DM, Fishman HA (2003) Building thick photoresist structures from the bottom up. J Micromech Microeng 13:380–382CrossRef Peterman MC, Huie P, Bloom DM, Fishman HA (2003) Building thick photoresist structures from the bottom up. J Micromech Microeng 13:380–382CrossRef
Zurück zum Zitat Turner R, Desta Y, Kelly K, Zhang J, Geiger E, Cortez S, Mancini DC (2003) Tapered LIGA HARMs. J Micromech Microeng 13:367–372CrossRef Turner R, Desta Y, Kelly K, Zhang J, Geiger E, Cortez S, Mancini DC (2003) Tapered LIGA HARMs. J Micromech Microeng 13:367–372CrossRef
Metadaten
Titel
Fabrication of a polymeric tapered HARMs array utilizing a low-cost nickel electroplated mold insert
verfasst von
In-Hyouk Song
Yoonyoung Jin
Pratul K. Ajmera
Publikationsdatum
01.02.2007
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 3-4/2007
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-006-0212-1

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