Skip to main content
Erschienen in: Microsystem Technologies 3/2008

01.03.2008 | Technical Paper

Optimization of control parameters in micro hot embossing

verfasst von: Yong He, Jian-Zhong Fu, Zi-Chen Chen

Erschienen in: Microsystem Technologies | Ausgabe 3/2008

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The key control parameters in hot embossing (such as the imprint pressure, the imprint temperature, the holding time and the demolding temperature) can significantly impact on the pattern quality. The finite element method was used to analyze the embossing, cooling and demolding step to acquire the optimized process parameters. The simulation results show that the polymer flow has a reference to the imprint pressure, the imprint temperature and the holding time. While the adhesion force between the polymer and the mold can significantly influence the replication accuracy. Because of polymer flow, non-uniform pressure distribution can be observed and this results in the pattern height difference. The hydraulic pressure system was designed to acquire uniform pressure. Thermal stress caused by the difference of the thermal expansion coefficients between the mold and the polymer can induce stress concentration at the corner. If the demolding direction is not vertical to horizon, another stress concentration will appear. Excessive stress results in defects and causes fracture at the base part of the pattern during the demolding step. To eliminate the defects, cooling to a relative high temperature was introduced to reduce the stress concentration and an auto-demolding device was used to insure no additional stress was imported at the demolding step. The following experiment showed the successful fabrication of fine patterns with the optimized parameters.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
Zurück zum Zitat Chien RD (2006) Hot embossing of microfluidic platform. Int Commun Heat Mass 33:645–653CrossRef Chien RD (2006) Hot embossing of microfluidic platform. Int Commun Heat Mass 33:645–653CrossRef
Zurück zum Zitat He Y, Fu JZ, Chen ZC (2007) Research on optimization of the hot embossing process. J Micromech Microeng 17:2420–2425CrossRef He Y, Fu JZ, Chen ZC (2007) Research on optimization of the hot embossing process. J Micromech Microeng 17:2420–2425CrossRef
Zurück zum Zitat Juang YJ, Lee JL, Kurt WK (2002) Hot embossing in microfabrication, part II Rheological characterization and process analysis. Polym Eng Sci 42:539–551CrossRef Juang YJ, Lee JL, Kurt WK (2002) Hot embossing in microfabrication, part II Rheological characterization and process analysis. Polym Eng Sci 42:539–551CrossRef
Zurück zum Zitat Lin CR, Chen RH, Chen CH (2003) Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures. J Mater Process Technol 140:173–178CrossRef Lin CR, Chen RH, Chen CH (2003) Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures. J Mater Process Technol 140:173–178CrossRef
Zurück zum Zitat Worgull M, Heckele M, Hétu JF et al (2006) Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication. J Microlithogr Microfabr Microsyst 5:011005CrossRef Worgull M, Heckele M, Hétu JF et al (2006) Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication. J Microlithogr Microfabr Microsyst 5:011005CrossRef
Zurück zum Zitat Yoshihiko H, Yoshida S, Nobuyuki T (2003) Defect analysis in thermal nanoimprint lithography. J Vac Sci Technol 21:2765–2770CrossRef Yoshihiko H, Yoshida S, Nobuyuki T (2003) Defect analysis in thermal nanoimprint lithography. J Vac Sci Technol 21:2765–2770CrossRef
Zurück zum Zitat Yoshihiko H, Takaaki K, Takashi Y (2004) Simulation and experimental study of polymer deformation in nanoimprint lithography. J Vac Sci Technol 42:3288–3293 Yoshihiko H, Takaaki K, Takashi Y (2004) Simulation and experimental study of polymer deformation in nanoimprint lithography. J Vac Sci Technol 42:3288–3293
Zurück zum Zitat Yao DG, Vinayshankar LV, Byung K (2005) Study on squeezing flow during nonisothermal embossing of polymer microstructure. Polym Eng Sci 45:652–660CrossRef Yao DG, Vinayshankar LV, Byung K (2005) Study on squeezing flow during nonisothermal embossing of polymer microstructure. Polym Eng Sci 45:652–660CrossRef
Metadaten
Titel
Optimization of control parameters in micro hot embossing
verfasst von
Yong He
Jian-Zhong Fu
Zi-Chen Chen
Publikationsdatum
01.03.2008
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 3/2008
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0497-8

Weitere Artikel der Ausgabe 3/2008

Microsystem Technologies 3/2008 Zur Ausgabe