Skip to main content
Erschienen in: Microsystem Technologies 6/2013

01.06.2013 | Technical Paper

ProTEK PSB coating as an alternative polymeric protection mask for KOH bulk etching of silicon

verfasst von: Rosminazuin Ab Rahim, Badariah Bais, Burhanuddin Yeop Majlis, Gandi Sugandi

Erschienen in: Microsystem Technologies | Ausgabe 6/2013

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

The utilization of a newly developed photosensitive polymeric coating, ProTEK PSB plays a significant role in realizing simple process steps in the fabrication of MEMS devices using bulk micromachining technology. The photosensitive coating which serves as an alternative to the conventional silicon nitride mask of bulk potassium hydroxide (KOH) etching in devising MEMS devices, particularly in suspended microcantilever structure, is reported in this study. Although the polymeric coating ProTEK PSB acts as an excellent outer protective layer from any pinhole issues, the coating’s lateral etching in the KOH solution is dominant, which results in an undercut problem. Therefore, few investigations have been carried out to identify the most suitable condition for the ProTEK PSB deposition on Si substrate. Initial investigation was done on the effect of Si surface modification on the stability of the ProTEK PSB in KOH etching. It was observed that the surface treatment may reduce the undercut ratio for a short period of KOH etching. However, for the extended hours, the surface treatment is not effective enough to improve the stability of the polymeric coating. Therefore, combinations of ProTEK PSB on three substrates were studied in order to obtain a minimum undercut to etch depth ratio of the polymeric coating in KOH bulk etching. The study showed that the combination of ProTEK PSB patterned on thermal oxide results in the most effective etching condition attributed by minimum undercut ratio. Further investigation was carried out on the effect of the KOH etching concentration on the stability of the ProTEK PSB coating over the long hours of bulk etching process. Three concentrations of KOH etchants, KOH 20 wt%, KOH 45 wt% and KOH with isopropyl alcohol (KOH + IPA) were investigated. The results showed that the stability of the polymeric coating was excellent in KOH 20 wt% concentration with a very minimal undercut ratio of 0.05–0.07. In conclusion, the utilization of the polymeric coating ProTEK PSB serves as an alternative etch mask in KOH wet etching which offers simpler and cheaper device fabrication in bulk micromachining technology.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
Zurück zum Zitat Bodas DS, Khan-Malek C (2007) Hydrophilization and hydrophobic recovery of PDMS by oxygen plasma and chemical treatment––an SEM investigation. Sens Actuators B 123:368–373CrossRef Bodas DS, Khan-Malek C (2007) Hydrophilization and hydrophobic recovery of PDMS by oxygen plasma and chemical treatment––an SEM investigation. Sens Actuators B 123:368–373CrossRef
Zurück zum Zitat Bodas DS, Mahapatra SK, Gangal SA (2005) Comparative study of spin coated and sputtered PMMA as an etch mask material for silicon micromachining. Sens Actuators A: Physical 120(2):582–588CrossRef Bodas DS, Mahapatra SK, Gangal SA (2005) Comparative study of spin coated and sputtered PMMA as an etch mask material for silicon micromachining. Sens Actuators A: Physical 120(2):582–588CrossRef
Zurück zum Zitat Liu C (2012) Foundation of MEMS, 2nd edn. Pearson Education Limited, England Liu C (2012) Foundation of MEMS, 2nd edn. Pearson Education Limited, England
Zurück zum Zitat Ljungberg K, Soderbag A, Backland Y (1993) Spontaneous bonding of hydrophobic silicon surface. Appl Phys Lett 62(12):1362–1364CrossRef Ljungberg K, Soderbag A, Backland Y (1993) Spontaneous bonding of hydrophobic silicon surface. Appl Phys Lett 62(12):1362–1364CrossRef
Zurück zum Zitat Maji D, Lahiri SK, Das S (2012) Study of hydrophilicity and stability of chemically modified PDMS surface using piranha and KOH solution. Surf Interface Anal 44:62–69CrossRef Maji D, Lahiri SK, Das S (2012) Study of hydrophilicity and stability of chemically modified PDMS surface using piranha and KOH solution. Surf Interface Anal 44:62–69CrossRef
Zurück zum Zitat Malhotra JD, Brand GJ, Zhong XF (2007) Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of the TALON wrap process. SPIE, Proc 6462 Malhotra JD, Brand GJ, Zhong XF (2007) Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of the TALON wrap process. SPIE, Proc 6462
Zurück zum Zitat Malhotra JD, Zhong XF, Planje C, Brand G, Yess K (2008) A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon. J Micromech Microeng 18:1–8 Malhotra JD, Zhong XF, Planje C, Brand G, Yess K (2008) A spin-on photosensitive polymeric etch protection mask for anisotropic wet etching of silicon. J Micromech Microeng 18:1–8
Zurück zum Zitat Powell O, Harrison HB (2001) Anisotropic etching of 100 and 110 planes in (100) silicon. J Micromech Microeng 11:217–220CrossRef Powell O, Harrison HB (2001) Anisotropic etching of 100 and 110 planes in (100) silicon. J Micromech Microeng 11:217–220CrossRef
Zurück zum Zitat Rahim RA, Bais B, Majlis BY (2008) Design and analysis of MEMS piezoresistive SiO2 cantilever-based sensor with stress concentration region for biosensing applications, In: Proceedings of 2008 IEEE international conference on semiconductor electronics (ICSE 2008), Kuala Lumpur, Malaysia, pp 211–215 Rahim RA, Bais B, Majlis BY (2008) Design and analysis of MEMS piezoresistive SiO2 cantilever-based sensor with stress concentration region for biosensing applications, In: Proceedings of 2008 IEEE international conference on semiconductor electronics (ICSE 2008), Kuala Lumpur, Malaysia, pp 211–215
Zurück zum Zitat Rahim RA, Bais B, Majlis BY (2009) Hybrid simulation approach on MEMS piezoresistive microcantilever sensor for biosensing applications. Adv Mater Res 74:243–246CrossRef Rahim RA, Bais B, Majlis BY (2009) Hybrid simulation approach on MEMS piezoresistive microcantilever sensor for biosensing applications. Adv Mater Res 74:243–246CrossRef
Zurück zum Zitat Seidel H, Csepregi L, Heuberger A, Baumgartel H (1990) Anisotropic etching of crystalline silicon in alkaline solutions. J Electrochem Soc 137(11):3612–3625CrossRef Seidel H, Csepregi L, Heuberger A, Baumgartel H (1990) Anisotropic etching of crystalline silicon in alkaline solutions. J Electrochem Soc 137(11):3612–3625CrossRef
Zurück zum Zitat Takahashi T, Makihata M, Esashi M, Tanaka S (2010) Evaluation and application of resist for alkaline wet etching. IEEJ Trans Sensors Micromach 130:421–425CrossRef Takahashi T, Makihata M, Esashi M, Tanaka S (2010) Evaluation and application of resist for alkaline wet etching. IEEJ Trans Sensors Micromach 130:421–425CrossRef
Zurück zum Zitat Williams KR, Gupta K, Wasilik M (2003) Etch rates for micromachining processing-part II. J Microelectromech Syst 12(6):761–778CrossRef Williams KR, Gupta K, Wasilik M (2003) Etch rates for micromachining processing-part II. J Microelectromech Syst 12(6):761–778CrossRef
Metadaten
Titel
ProTEK PSB coating as an alternative polymeric protection mask for KOH bulk etching of silicon
verfasst von
Rosminazuin Ab Rahim
Badariah Bais
Burhanuddin Yeop Majlis
Gandi Sugandi
Publikationsdatum
01.06.2013
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 6/2013
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-013-1794-z

Weitere Artikel der Ausgabe 6/2013

Microsystem Technologies 6/2013 Zur Ausgabe