Skip to main content
Erschienen in: Journal of Material Cycles and Waste Management 3/2023

28.03.2023 | ORIGINAL ARTICLE

Removal of iron from waste printed circuit board dust: surfactant assisted magnetic separation versus selective leaching routes

verfasst von: Oluwayimika Olasunkanmi Oluokun, Iyiola Olatunji Otunniyi

Erschienen in: Journal of Material Cycles and Waste Management | Ausgabe 3/2023

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config
loading …

Abstract

Iron content in printed circuit board (PCB) dust consumes complexing agents, compromises recovery and contaminates leach solution during precious metals recovery from this waste stream. This study evaluated the prospects of iron removal from PCB dust via wet magnetic separation (WMS) versus sulphuric acid leaching. Chemical conditioning of the PCB pulp is required to make WMS effective in this case; this is a factor still new to magnetic separation technology. This was studied as a function of surface tension variation to optimize magnetic separation. For selective leaching route, the PCB dust was first treated with ammonia to selectively pre-remove copper, followed by sulphuric acid treatment of the residue for iron removal. After these investigations, the best performance from WMS gave a separation efficiency of 87%, whilst selective leaching efficiency for iron removal was 98%. Both routes compromise zinc and nickel into their ferrous streams, but the WMS route also compromised gold and silver. Though wet magnetic separation efficiency was greatly enhanced by pulp surfactant conditioning investigated herein, the selective leaching route is still more effective for iron removal from the PCB dust for this assorted material fraction, considering the risk of compromising gold loss to the ferrous fraction.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literatur
1.
Zurück zum Zitat Marra A, Cesaro A, Belgiorno V (2018) Separation efficiency of valuable and critical metals in WEEE mechanical treatments. J Clean Prod 186:490–498CrossRef Marra A, Cesaro A, Belgiorno V (2018) Separation efficiency of valuable and critical metals in WEEE mechanical treatments. J Clean Prod 186:490–498CrossRef
2.
Zurück zum Zitat Oluokun O, I Otunniyi (2017) Printed circuit board as an urban mining commodity in South Africa. South Afr Inst Ind Eng (SAIIE) 28:375–386 Oluokun O, I Otunniyi (2017) Printed circuit board as an urban mining commodity in South Africa. South Afr Inst Ind Eng (SAIIE) 28:375–386
3.
Zurück zum Zitat Sarvar M, Salarirad MM, Shabani MA (2015) Characterization and mechanical separation of metals from computer printed circuit boards (PCBs) based on mineral processing methods. Waste Manag 45:246–257CrossRef Sarvar M, Salarirad MM, Shabani MA (2015) Characterization and mechanical separation of metals from computer printed circuit boards (PCBs) based on mineral processing methods. Waste Manag 45:246–257CrossRef
4.
Zurück zum Zitat Brent HJ, Atluri V (1988) Dissolution chemistry of gold and silver in different lixiviants. Miner Process Extr Metall Rev 4:95–134CrossRef Brent HJ, Atluri V (1988) Dissolution chemistry of gold and silver in different lixiviants. Miner Process Extr Metall Rev 4:95–134CrossRef
5.
Zurück zum Zitat Donald WD et al (1982) The NBS tables of chemical thermodynamic properties, selected values for inorganic and C1 and C2 organic substances in SI units. Phys Chem Ref Data 11(2):1–407 Donald WD et al (1982) The NBS tables of chemical thermodynamic properties, selected values for inorganic and C1 and C2 organic substances in SI units. Phys Chem Ref Data 11(2):1–407
6.
Zurück zum Zitat Hao J et al (2020) Metal recovery from waste printed circuit boards: a review for current status and perspectives. Resour Conserv Recycl 157:104787CrossRef Hao J et al (2020) Metal recovery from waste printed circuit boards: a review for current status and perspectives. Resour Conserv Recycl 157:104787CrossRef
7.
Zurück zum Zitat Pinho S, Ferreira M, Almeida MF (2018) A wet dismantling process for the recycling of computer printed circuit boards. Resour Conserv Recycl 132:71–76CrossRef Pinho S, Ferreira M, Almeida MF (2018) A wet dismantling process for the recycling of computer printed circuit boards. Resour Conserv Recycl 132:71–76CrossRef
8.
Zurück zum Zitat Veit HM et al (2005) Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap. Waste Manag 25(1):67–74CrossRef Veit HM et al (2005) Utilization of magnetic and electrostatic separation in the recycling of printed circuit boards scrap. Waste Manag 25(1):67–74CrossRef
9.
Zurück zum Zitat Xian Y et al (2021) Recovery of metals from heat-treated printed circuit boards via an enhanced gravity concentrator and high-gradient magnetic separator. Materials 14(16):4566CrossRef Xian Y et al (2021) Recovery of metals from heat-treated printed circuit boards via an enhanced gravity concentrator and high-gradient magnetic separator. Materials 14(16):4566CrossRef
10.
Zurück zum Zitat Oluokun OO, Otunniyi IO (2020) Chemical conditioning for wet magnetic separation of printed circuit board using octyl phenol ethoxylate. Sep Purif Technol 240:116586CrossRef Oluokun OO, Otunniyi IO (2020) Chemical conditioning for wet magnetic separation of printed circuit board using octyl phenol ethoxylate. Sep Purif Technol 240:116586CrossRef
11.
Zurück zum Zitat Chaudhuri RG, Paria S (2009) Dynamic contact angles on PTFE surface by aqueous surfactant solution in the absence and presence of electrolytes. J Colloid Interface Sci 337(2):555–562CrossRef Chaudhuri RG, Paria S (2009) Dynamic contact angles on PTFE surface by aqueous surfactant solution in the absence and presence of electrolytes. J Colloid Interface Sci 337(2):555–562CrossRef
12.
Zurück zum Zitat Lucheva B, Iliev P, Kolev D (2017) Recovery of gold from electronic waste by iodine–iodide leaching. J Chem Technol Metall 52(2):326–332 Lucheva B, Iliev P, Kolev D (2017) Recovery of gold from electronic waste by iodine–iodide leaching. J Chem Technol Metall 52(2):326–332
13.
Zurück zum Zitat Sheng PP, Etsell TH (2007) Recovery of gold from computer circuit board scrap using aqua regia. Waste Manag Res 25(4):380–383CrossRef Sheng PP, Etsell TH (2007) Recovery of gold from computer circuit board scrap using aqua regia. Waste Manag Res 25(4):380–383CrossRef
14.
Zurück zum Zitat Havlik T et al (2011) Hydrometallurgical treatment of used printed circuit boards after thermal treatment. Waste Manag 31(7):1542–1546CrossRef Havlik T et al (2011) Hydrometallurgical treatment of used printed circuit boards after thermal treatment. Waste Manag 31(7):1542–1546CrossRef
15.
Zurück zum Zitat Davis A, Tran T (1992) Fundamental aspects of gold leaching in halide media. Proceeding of the EDP 92:99–114 Davis A, Tran T (1992) Fundamental aspects of gold leaching in halide media. Proceeding of the EDP 92:99–114
16.
Zurück zum Zitat Vanysek P (2000) Electrochemical series. In: Raji K (ed) CRC Handbook of Chemistry and Physics, vol 8. CRC Press, Boca Raton, New York Vanysek P (2000) Electrochemical series. In: Raji K (ed) CRC Handbook of Chemistry and Physics, vol 8. CRC Press, Boca Raton, New York
17.
Zurück zum Zitat Hu Z, Qi L (2014) 15.5—Sample digestion methods. In: Raji K (ed) Treatise on Geochemistry (Second Edition), vol 1. Elsevier, Oxford, pp 87–109CrossRef Hu Z, Qi L (2014) 15.5—Sample digestion methods. In: Raji K (ed) Treatise on Geochemistry (Second Edition), vol 1. Elsevier, Oxford, pp 87–109CrossRef
18.
Zurück zum Zitat Rand D, Woods R (1972) A study of the dissolution of platinum, palladium, rhodium and gold electrodes in 1 M sulphuric acid by cyclic voltammetry. J Electroanal Chem Interfacial Electrochem 35(1):209–218CrossRef Rand D, Woods R (1972) A study of the dissolution of platinum, palladium, rhodium and gold electrodes in 1 M sulphuric acid by cyclic voltammetry. J Electroanal Chem Interfacial Electrochem 35(1):209–218CrossRef
19.
Zurück zum Zitat Quinet P, Proost J, Van Lierde A (2005) Recovery of precious metals from electronic scrap by hydrometallurgical processing routes. Miner Metall Process 22(1):17–22 Quinet P, Proost J, Van Lierde A (2005) Recovery of precious metals from electronic scrap by hydrometallurgical processing routes. Miner Metall Process 22(1):17–22
20.
Zurück zum Zitat Le HL et al (2011) Hydrometallurgical process for copper recovery from waste printed circuit boards (PCBs). Miner Process Extr Metall 32(2):90–104CrossRef Le HL et al (2011) Hydrometallurgical process for copper recovery from waste printed circuit boards (PCBs). Miner Process Extr Metall 32(2):90–104CrossRef
21.
Zurück zum Zitat Akcil A et al (2015) Precious metal recovery from waste printed circuit boards using cyanide and non-cyanide lixiviants–a review. Waste Manag 45:258–271CrossRef Akcil A et al (2015) Precious metal recovery from waste printed circuit boards using cyanide and non-cyanide lixiviants–a review. Waste Manag 45:258–271CrossRef
22.
Zurück zum Zitat Ghosh B et al (2015) Waste printed circuit boards recycling: an extensive assessment of current status. J Clean Prod 94:5–19CrossRef Ghosh B et al (2015) Waste printed circuit boards recycling: an extensive assessment of current status. J Clean Prod 94:5–19CrossRef
23.
Zurück zum Zitat Oluokun O, Otunniyi I (2019) Capacity integration in southern africa for precious metal recycling from printed circuit board. J Emerg Trends Eng Appl Sci (JETEAS) 10(5):219–225 Oluokun O, Otunniyi I (2019) Capacity integration in southern africa for precious metal recycling from printed circuit board. J Emerg Trends Eng Appl Sci (JETEAS) 10(5):219–225
24.
Zurück zum Zitat Hageluken C (2006) Improving metal returns and eco-efficiency in electronics recycling-a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining. In: Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006, USA, pp 218–223 Hageluken C (2006) Improving metal returns and eco-efficiency in electronics recycling-a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining. In: Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006, USA, pp 218–223
25.
Zurück zum Zitat Hagelüken C (2006) Recycling of electronic scrap at Umicore’s integrated metals smelter and refinery. Erzmetall 59(3):152–161 Hagelüken C (2006) Recycling of electronic scrap at Umicore’s integrated metals smelter and refinery. Erzmetall 59(3):152–161
26.
Zurück zum Zitat Oluokun OO, Otunniyi IO (2020) Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching. Hydrometallurgy 193:105320CrossRef Oluokun OO, Otunniyi IO (2020) Kinetic analysis of Cu and Zn dissolution from printed circuit board physical processing dust under oxidative ammonia leaching. Hydrometallurgy 193:105320CrossRef
27.
Zurück zum Zitat Oh CJ et al (2003) Selective leaching of valuable metals from waste printed circuit boards. J Air Waste Manag Assoc 53(7):897–902CrossRef Oh CJ et al (2003) Selective leaching of valuable metals from waste printed circuit boards. J Air Waste Manag Assoc 53(7):897–902CrossRef
28.
Zurück zum Zitat Jha MK et al (2011) Pressure leaching of metals from waste printed circuit boards using sulfuric acid. JOM 63(8):29CrossRef Jha MK et al (2011) Pressure leaching of metals from waste printed circuit boards using sulfuric acid. JOM 63(8):29CrossRef
29.
Zurück zum Zitat Mecucci A, Scott K (2002) Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards. J Chem Technol Biotechnol 77(4):449–457CrossRef Mecucci A, Scott K (2002) Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards. J Chem Technol Biotechnol 77(4):449–457CrossRef
30.
Zurück zum Zitat Hu S et al (2006) Alkaline leaching of printed circuit board sludge. Environ Prog 25(3):243–250CrossRef Hu S et al (2006) Alkaline leaching of printed circuit board sludge. Environ Prog 25(3):243–250CrossRef
31.
Zurück zum Zitat Ajiboye AE et al (2019) Extraction of copper and zinc from waste printed circuit boards. Recycling 4(3):36CrossRef Ajiboye AE et al (2019) Extraction of copper and zinc from waste printed circuit boards. Recycling 4(3):36CrossRef
32.
Zurück zum Zitat Ogunniyi I, Vermaak M, Groot D (2009) Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations. Waste Manag 29(7):2140–2146CrossRef Ogunniyi I, Vermaak M, Groot D (2009) Chemical composition and liberation characterization of printed circuit board comminution fines for beneficiation investigations. Waste Manag 29(7):2140–2146CrossRef
33.
Zurück zum Zitat Yamane LH et al (2011) Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers. Waste Manag 31(12):2553–2558CrossRef Yamane LH et al (2011) Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers. Waste Manag 31(12):2553–2558CrossRef
34.
Zurück zum Zitat Priac A et al (2017) Alkylphenol and alkylphenol polyethoxylates in water and wastewater: a review of options for their elimination. Arab J Chem 10:S3749–S3773CrossRef Priac A et al (2017) Alkylphenol and alkylphenol polyethoxylates in water and wastewater: a review of options for their elimination. Arab J Chem 10:S3749–S3773CrossRef
35.
Zurück zum Zitat Ines MH et al (2017) The dynamic surface tension of water. J Phys Chem Lett 8(7):1599–1603CrossRef Ines MH et al (2017) The dynamic surface tension of water. J Phys Chem Lett 8(7):1599–1603CrossRef
36.
Zurück zum Zitat Napier-Munn T, BA Wills (2005) Wills’ mineral processing technology Napier-Munn T, BA Wills (2005) Wills’ mineral processing technology
37.
Zurück zum Zitat Schulz NF (1970) Separation efficiency. Trans SME-AIME 247:56 Schulz NF (1970) Separation efficiency. Trans SME-AIME 247:56
38.
Zurück zum Zitat Longobardo AV (2010) Glass fibers for printed circuit boards. Fiberglass and glass technology. Springer, New York, pp 175–196CrossRef Longobardo AV (2010) Glass fibers for printed circuit boards. Fiberglass and glass technology. Springer, New York, pp 175–196CrossRef
39.
Zurück zum Zitat Tarr M (2017) Printed circuit boards-Conductor finishes: nickel-gold Tarr M (2017) Printed circuit boards-Conductor finishes: nickel-gold
40.
Zurück zum Zitat Taliha S (2016) Some physicochemical properties of octylphenol ethoxylate nonionics (triton x-100, triton x-114 and triton x-405 and the temperature effect on this properties. J Nat Sci 13(2):101–116 Taliha S (2016) Some physicochemical properties of octylphenol ethoxylate nonionics (triton x-100, triton x-114 and triton x-405 and the temperature effect on this properties. J Nat Sci 13(2):101–116
41.
Zurück zum Zitat Katarzyna S, Janczuk B (2007) The Adsorption at solution−air interface and volumetric properties of mixtures of cationic and nonionic surfactants. Colloids Surf 293:39–50CrossRef Katarzyna S, Janczuk B (2007) The Adsorption at solution−air interface and volumetric properties of mixtures of cationic and nonionic surfactants. Colloids Surf 293:39–50CrossRef
42.
Zurück zum Zitat Rosen MJ, Kunjappu JT (2012) Surfactants and interfacial phenomena. John Wiley & Sons, Hoboken, USACrossRef Rosen MJ, Kunjappu JT (2012) Surfactants and interfacial phenomena. John Wiley & Sons, Hoboken, USACrossRef
Metadaten
Titel
Removal of iron from waste printed circuit board dust: surfactant assisted magnetic separation versus selective leaching routes
verfasst von
Oluwayimika Olasunkanmi Oluokun
Iyiola Olatunji Otunniyi
Publikationsdatum
28.03.2023
Verlag
Springer Japan
Erschienen in
Journal of Material Cycles and Waste Management / Ausgabe 3/2023
Print ISSN: 1438-4957
Elektronische ISSN: 1611-8227
DOI
https://doi.org/10.1007/s10163-023-01644-5

Weitere Artikel der Ausgabe 3/2023

Journal of Material Cycles and Waste Management 3/2023 Zur Ausgabe