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Erschienen in: Metallurgical and Materials Transactions A 13/2011

01.12.2011

Quantitative Evaluation of Bulk and Interface Microstructures in Al-3003 Alloy Builds Made by Very High Power Ultrasonic Additive Manufacturing

verfasst von: Hiromichi T. Fujii, M. R. Sriraman, S. S. Babu

Erschienen in: Metallurgical and Materials Transactions A | Ausgabe 13/2011

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Abstract

Ultrasonically consolidated 3003 aluminum alloy builds were prepared with constituent tapes by using a very high power ultrasonic additive manufacturing (UAM) process. Microstructures of interface and bulk regions were quantitatively characterized using the electron backscattered diffraction technique. The interface microstructure consists of equiaxed grains. The 〈111〉 crystallographic directions of these grains were aligned with the normal direction of the specimen, confirming a shear deformation mode at these regions. In addition, due to recrystallization, the density of low-angle grain boundaries also significantly decreased. In contrast, original elongated grains and partially recrystallized grains were observed in the bulk region of the tape. These elongated grains correspond to rolling texture components of face-centered-cubic materials. The preceding microstructure gradients are rationalized based on the accumulated thermomechanical cycles during processing.

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Fußnoten
1
In this document, tapes and foils are used interchangeably to allow for better readability.
 
2
PHILIPS is a trademark of FEI Company, Hillsboro, OR.
 
3
TSL OIM is a trademark of EDAX Inc., Draper, UT.
 
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Metadaten
Titel
Quantitative Evaluation of Bulk and Interface Microstructures in Al-3003 Alloy Builds Made by Very High Power Ultrasonic Additive Manufacturing
verfasst von
Hiromichi T. Fujii
M. R. Sriraman
S. S. Babu
Publikationsdatum
01.12.2011
Verlag
Springer US
Erschienen in
Metallurgical and Materials Transactions A / Ausgabe 13/2011
Print ISSN: 1073-5623
Elektronische ISSN: 1543-1940
DOI
https://doi.org/10.1007/s11661-011-0805-x

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