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Erschienen in: Microsystem Technologies 8-9/2010

01.08.2010 | Technical Paper

Effect of oxalic acid concentration on the formation of anodic aluminum oxide using pulse anodization at room temperature

verfasst von: Chen-Kuei Chung, T. Y. Liu, W. T. Chang

Erschienen in: Microsystem Technologies | Ausgabe 8-9/2010

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Abstract

Most anodic aluminum oxide (AAO) or porous anodic aluminum (PAA) films were fabricated using the potentiostatic method from high-purity (99.999%) aluminum films at low temperatures of 0–10°C to avoid dissolution effects at room temperature (RT). In this article, the fabrication of AAO or PAA film from commercial purity (99%) aluminum at RT has been investigated using hybrid pulse anodization under different oxalic acid concentration and process duration. The effect of acid concentration and anodization duration on the formation of AAO size and morphology has been studied. Both pore diameter and oxide layer thickness of AAO films were examined via SEM images and found that both increased with increasing oxalic concentration and anodization duration. In addition, the pore distribution was more concentrated at high electrolytic concentration and anodization duration.

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Metadaten
Titel
Effect of oxalic acid concentration on the formation of anodic aluminum oxide using pulse anodization at room temperature
verfasst von
Chen-Kuei Chung
T. Y. Liu
W. T. Chang
Publikationsdatum
01.08.2010
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 8-9/2010
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-009-0944-9

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