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Erschienen in: Microsystem Technologies 9-10/2013

01.09.2013 | Technical Paper

Analysis of contact phenomena between a head stack assembly and disk during operational shock

verfasst von: Seokhwan Kim, Geonyup Lim, No-Cheol Park, Young-Pil Park, Hyun-Chul Lee, Ju-Ho Kim, Kyoung-Su Park

Erschienen in: Microsystem Technologies | Ausgabe 9-10/2013

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Abstract

A hard disk drive (HDD) is very sensitive to shock. Increasing portability demands have led to increased HDD exposure to unexpected shocks. Therefore, the dynamic characteristics of an HDD were utilized to investigate the relative behavior of the disk and head stack assembly (HSA) during operational shock. A finite element model of HDD was constructed to simulate operational shock. This model included the spindle system, base, HSA, and disk. The relative behavior of the disk and HSA was analyzed using different bases with different stiffness. A drop test was performed to verify the simulation results. A modified base design was then proposed to protect against contact between the disk and HSA in HDD.

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Metadaten
Titel
Analysis of contact phenomena between a head stack assembly and disk during operational shock
verfasst von
Seokhwan Kim
Geonyup Lim
No-Cheol Park
Young-Pil Park
Hyun-Chul Lee
Ju-Ho Kim
Kyoung-Su Park
Publikationsdatum
01.09.2013
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 9-10/2013
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-013-1867-z

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