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Microsystem Technologies

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01.08.2014 | Technical Paper

An investigation of thermal asperity sensors during contact with disk asperities

verfasst von: Chuanwei Zhang, Andrey Ovcharenko, Min Yang, Neil Knudson, Frank E. Talke

Erschienen in: Microsystem Technologies | Ausgabe 8-9/2014

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Abstract

In this study, a thermo-mechanical finite element model was developed for the response of a thermal asperity sensor sliding against a disk asperity. The temperature change of the thermal asperity sensor due to frictional heating was determined. The effect of disk asperity material properties and contact conditions is investigated.

Vorheriger Artikel Thermal fly-height controlled glide for disk defect detection and defect size estimation for hard disk drives

Nächster Artikel Slit design for the thermal flying height control slider

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Titel: An investigation of thermal asperity sensors during contact with disk asperities
verfasst von: Chuanwei Zhang
Andrey Ovcharenko
Min Yang
Neil Knudson
Frank E. Talke
Publikationsdatum: 01.08.2014
Verlag: Springer Berlin Heidelberg
Erschienen in: Microsystem Technologies / Ausgabe 8-9/2014
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI: https://doi.org/10.1007/s00542-014-2166-z

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