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Microsystem Technologies
Erschienen in: Microsystem Technologies 2/2018

20.10.2017 | Review Article

Embedded passive components in advanced 3D chips and micro/nano electronic systems

verfasst von: Muhammad Imran Khan, Huang Dong, Faisal Shabbir, Rizwan Shoukat

Erschienen in: Microsystem Technologies | Ausgabe 2/2018

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Abstract

Electronic devices are shrinking day by day, while the speed and reliability is increasing. At the same time, IC designs and micro/nano electronic systems are becoming extremely complex with billions of components squeezed into a small area of silicon. Due to increase in functionality and decrease in size, number of components have increased on small area in IC and PWB. The use of passive components like capacitors, resistors and inductors is also increasing with time. The old surface mounted passive components occupy more area. The solution is to embed passive components inside the substrate, thereby decreasing the size. In the new technology, embedding passive components inside the substrate of the chip and the PWB results in an improvement in the reliability factor and at the same time improves the electrical performance.
Vorheriger Artikel Optimal design of high-g MEMS piezoresistive accelerometer based on Timoshenko beam theory
Nächster Artikel Controllable printing droplets on demand by piezoelectric inkjet: applications and methods

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Metadaten
Titel
Embedded passive components in advanced 3D chips and micro/nano electronic systems
verfasst von
Muhammad Imran Khan
Huang Dong
Faisal Shabbir
Rizwan Shoukat
Publikationsdatum
20.10.2017
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 2/2018
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-017-3586-3

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