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Journal of Materials Science
Erschienen in: Journal of Materials Science 15/2018

07.05.2018 | Chemical routes to materials

Preparation and mechanism of shape memory bismaleimide resins with high transition temperature, high toughness and good processability

verfasst von: Banghui Chen, Li Yuan, Qingbao Guan, Guozheng Liang, Aijuan Gu

Erschienen in: Journal of Materials Science | Ausgabe 15/2018

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Abstract

Developing shape memory polymers (SMPs) with high transition temperature (Ttrans), good toughness and good processability (low molding temperature and solvent-free) is still a great challenge. Herein, a new type of thermosetting shape memory resin (BDPH) is developed based on bismaleimide resin (BD), cardo-polyetherketone (PEK-C) and multi-maleimide-terminated branched polysiloxane (HSi). The effect and mechanism of the compositions on structure and key properties (heat resistance, toughness and shape memory effect) of resins were systematically investigated. Results show that BDPH system has outstanding integrated properties. Specifically, for the resin with optimal composition (BDPH10), its Ttrans is as high as 292 °C, about 30 °C higher than that of thermosetting SMPs (TS-SMPs) reported so far; meanwhile, the maximum curing temperature of BDPH10 is about 40 °C lower than those of TS-SMPs of which Ttrans values are higher than 270 °C. The shape fixed rate and shape recovery rate of BDPH10 are 97.5 and 98.7%, respectively; besides, BDPH10 has high toughness, its impact strength is 21.8 kJ m−2, about two times of that of BD resin, overcoming the drawback of traditional thermosetting SMPs. The mechanism behind those attractive performances of BDPH is proved to be attributed to the effects derived from PEK-C and HSi.
Vorheriger Artikel Synthesis of a novel cardanol-based compound and environmentally sustainable production of phenolic foam
Nächster Artikel Development and characterization of Al/MWCNT–Al2O3 hybrid composite by accumulative roll bonding

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Metadaten
Titel
Preparation and mechanism of shape memory bismaleimide resins with high transition temperature, high toughness and good processability
verfasst von
Banghui Chen
Li Yuan
Qingbao Guan
Guozheng Liang
Aijuan Gu
Publikationsdatum
07.05.2018
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 15/2018
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-018-2367-4

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