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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 1-3/2007

01.03.2007

Composite lead-free electronic solders

verfasst von: Fu Guo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 1-3/2007

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Abstract

Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
Vorheriger Artikel Sn–Zn low temperature solder
Nächster Artikel Processing and material issues related to lead-free soldering

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Metadaten
Titel
Composite lead-free electronic solders
verfasst von
Fu Guo
Publikationsdatum
01.03.2007
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 1-3/2007
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-006-9019-1

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