Physical and electrical attributes of sintered Ag₈₀–Al₂₀ high temperature die attach material with different organic additives content

In this work, the primary focus was to establish a relationship between the post-sintered physical attributes of the high temperature Ag₈₀–Al₂₀ die attach material and its electrical performance. The post-sintered Ag₈₀–Al₂₀ die attach material depicted the formation of Ag₂Al and Ag₃Al compounds. The melting point and maximum operational temperature for the Ag₈₀–Al₂₀ die attach material was determined to be 518 ± 1 °C and approximately 400 °C respectively, whereby the maximum operational temperature was based on a homologue temperature ratio of 0.85. The die attach material also demonstrated good electrical properties, i.e., an electrical conductivity value of 1.005 × 10⁵ (ohm–cm)⁻¹, which is higher than or equal to that of most solder systems. By varying the nanoparticle versus organics content between 83.3 and 87.0 %, it was seen that the surface morphology of the die attach material changed and the root-mean-square roughness values reduced to 175.1 nm. A similar observation was seen as the sintering temperature increased between 100 and 380 °C. This reduction in surface roughness proved that there was grain growth and particle coalescence within the die attach material. This translated to a reduction in electrical resistivity. Die attach area and thickness simulations found that smaller and thinner die attach areas are preferred for the Ag₈₀–Al₂₀ die attach material, whereby the highest recorded electrical conductivity value was 1.006 × 10⁵ (ohm–cm)⁻¹ for an area of 0.2 × 0.2 cm² and thickness of 25.4 μm.