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Erschienen in:
28.04.2016
Study on microstructure and properties of Sn–0.3Ag–0.7Cu solder bearing Nd
Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 8/2016
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Abstract
The properties and microstructure of Sn–0.3Ag–0.7Cu solder bearing trace amount of rare earth Nd were investigated in this paper. It was found that adding appropriate Nd can improve the properties of solder, the wettability of Sn–0.3Ag–0.7Cu–xNd solder was greatly improved and the mechanical properties were significantly enhanced when the addition of Nd reached 0.1 wt%. It was also found that the microstructure of solder was refined with the increasing content of Nd up to 0.1 wt%. In addition, when the Nd content exceeded 0.25 % a Sn–Nd phase appeared in the solder matrix. Comparing all the results, the comprehensive properties of Sn–0.3Ag–0.7Cu–0.1Nd solder were close to that of the traditional Sn–3.8Ag–0.7Cu solder, even though the content of Ag has been significantly reduced from 3.8 to 0.3 wt%, which had shown a great application prospect to satisfy the increasing requirements of low cost and high performance in the electronics industry.