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Microsystem Technologies
Erschienen in: Microsystem Technologies 7/2015

01.07.2015 | Technical Paper

Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers

verfasst von: Jian Zhao, Fei Jin, Jianying Zhao, Shaomin Liu

Erschienen in: Microsystem Technologies | Ausgabe 7/2015

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Abstract

In this paper, we introduce a new bonding technology for the assembly of micro- structured glass substrates for miniaturized chemical analysis. The protocol features a facile polymer chemistry method processing at lower temperatures (<100 °C). The method consisted of a proper cleaning of the two glass surfaces, followed by hydroxylization, aminosilylation and hyperbranched polyurethane oligomers (HPU) bridging on quartz wafer surfaces as the interlayer. Strong bonding with a shear force 4.5 MPa has been achieved. The present procedure avoids the possible micro-channel blockage and contamination by using conventional adhesives. Moreover, the microfluidic chips bonded by the above procedures are highly transparent therefore allowing for biochemical compositions to be easily characterized by UV–vis or IR spectroscopy.
Vorheriger Artikel Parallel integration of ionic wind generators on PCBs for enhancing flow rate
Nächster Artikel Fabrication of two-gimbal Ni–Fe torsional micro-gyroscope by SU-8 based UV-LIGA process

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Metadaten
Titel
Low-temperature quartz wafer bonding using hyperbranched polyurethane oligomers
verfasst von
Jian Zhao
Fei Jin
Jianying Zhao
Shaomin Liu
Publikationsdatum
01.07.2015
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 7/2015
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-014-2258-9

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