Anzeige
Erschienen in:
01.09.2014
Microstructure and Mechanical Properties of AlN/Cu Brazed Joints
Erschienen in: Journal of Materials Engineering and Performance | Ausgabe 9/2014
EinloggenAktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.
Wählen Sie Textabschnitte aus um mit Künstlicher Intelligenz passenden Patente zu finden. powered by
Markieren Sie Textabschnitte, um KI-gestützt weitere passende Inhalte zu finden. powered by
Abstract
In this study, the AlN/Cu bonding was explored using the brazing technique. During AlN/Cu brazing, the temperature was set at 800, 850, and 900 °C for 10, 20, 30, and 60 min, respectively.
We studied the bonding mechanism, microstructure formation, and the mechanical characteristics of the bond. The reaction layer developed at the interface of AlN/Cu is observed to be TiN. The activation energy of TiN is about 149.91 kJ/mol. The reaction layer thickness is linearly dependent on the temperature and duration at 800 and 850 °C for 60 min and 900 °C for 30 min. However, the growth of the reactive layers decreases gradually at 900 °C when the duration changed from 30 to 60 min. The strength of the specimens with thickness ranging between 1 and 1.5 μm is 40-51 MPa.