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Microsystem Technologies

Ausgabe 9/2009

Inhalt (17 Artikel)

Fabrication and testing of embedded microvalves within PMMA microfluidic devices

  • Technical Paper

Alicia Guek Geok Toh, Sum Huan Ng, Zhenfeng Wang

Radial superresolution of the two-photon microfabrication method

  • Open Access
  • Technical Paper

Peng Wei, Qiaofeng Tan, Yu Zhu, Guanghong Duan

Dynamic characteristics and forced response of an electrostatically-actuated microbeam subjected to fluid loading

  • Technical Paper

Ghader Rezazadeh, Mohammad Fathalilou, Rasool Shabani, Saeid Tarverdilou, Soheil Talebian

The effect of the microfluidic diodicity on the efficiency of valve-less rectification micropumps using Lattice Boltzmann Method

  • Technical Paper

Ahmed Fadl, Zongqin Zhang, Sebastian Geller, Jonas Tölke, Manfred Krafczyk, Donna Meyer

Fabrication, constructions and electrical property of Si2Sb2Te5 electrical probe storage system

  • Technical Paper

Yanbo Liu, Zhitang Song, Ting Zhang, Guoxin Zhang, Jing Zhang, Weimin Zhou, Jianpin Zhang

Filling of very deep, wide trenches by BenzoCycloButene polymer

  • Technical Paper

Hicham Eldin Mahfoz Kotb, K. Isoird, F. Morancho, L. Théolier, T. Do Conto

High sensitivity and small size MEMS capacitive microphone using a novel slotted diaphragm

  • Technical Paper

Bahram Azizollah Ganji, Burhanuddin Yeop Majlis

Kinetic masks: a new approach and device for dispersing biologically relevant fluids

  • Open Access
  • Technical Paper

Ina Meiser, Stephen Graham Shirley, Heiko Zimmermann

Precision manufacturing of key components for an ultra miniature gas turbine unit for power generation

  • Technical Paper

Kun Liu, Tobias Waumans, Jan Peirs, Dominiek Reynaerts

Comparison of micro-dispensing performance between micro-valve and piezoelectric printhead

  • Technical Paper

Jie Sun, Jinh Hao Ng, Ying Hsi Fuh, Yoke San Wong, Han Tong Loh, Qian Xu

Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches

  • Technical Paper

Magali Brunet, Pascal Dubreuil, Hicham Mahfoz-Kotb, Aline Gouantes, Anne-Marie Dorthe

Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation

  • Technical Paper

Bernhard Wunderle, K.-F. Becker, R. Sinning, O. Wittler, R. Schacht, H. Walter, M. Schneider-Ramelow, K. Halser, N. Simper, B. Michel, H. Reichl

    Marktübersichten

    Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen. 

    Bildnachweise
    MKVS GbR/© MKVS GbR, Nordson/© Nordson, ViscoTec/© ViscoTec, BCD Chemie GmbH, Merz+Benteli/© Merz+Benteli, Robatech/© Robatech, Ruderer Klebetechnik GmbH, Xometry Europe GmbH/© Xometry Europe GmbH, Atlas Copco/© Atlas Copco, Sika/© Sika, Medmix/© Medmix, Kisling AG/© Kisling AG, Dosmatix GmbH/© Dosmatix GmbH, Innotech GmbH/© Innotech GmbH, Hilger u. Kern GmbH, VDI Logo/© VDI Wissensforum GmbH, Dr. Fritz Faulhaber GmbH & Co. KG/© Dr. Fritz Faulhaber GmbH & Co. KG, ECHTERHAGE HOLDING GMBH&CO.KG - VSE, mta robotics AG/© mta robotics AG, Bühnen, The MathWorks Deutschland GmbH/© The MathWorks Deutschland GmbH, Spie Rodia/© Spie Rodia, Schenker Hydraulik AG/© Schenker Hydraulik AG