Ausgabe 9/2009
Inhalt (17 Artikel)
Fabrication and testing of embedded microvalves within PMMA microfluidic devices
Alicia Guek Geok Toh, Sum Huan Ng, Zhenfeng Wang
On the determination of Poisson’s ratio of stressed monolayer and bilayer submicron thick films
P. Martins, C. Malhaire, S. Brida, D. Barbier
Radial superresolution of the two-photon microfabrication method
Peng Wei, Qiaofeng Tan, Yu Zhu, Guanghong Duan
Dynamic characteristics and forced response of an electrostatically-actuated microbeam subjected to fluid loading
Ghader Rezazadeh, Mohammad Fathalilou, Rasool Shabani, Saeid Tarverdilou, Soheil Talebian
Indirectly heated micro-electrothermal actuator with a monolithically integrated displacement sensor
Kongying Xie, Yongjun Lai
The effect of the microfluidic diodicity on the efficiency of valve-less rectification micropumps using Lattice Boltzmann Method
Ahmed Fadl, Zongqin Zhang, Sebastian Geller, Jonas Tölke, Manfred Krafczyk, Donna Meyer
Fabrication, constructions and electrical property of Si2Sb2Te5 electrical probe storage system
Yanbo Liu, Zhitang Song, Ting Zhang, Guoxin Zhang, Jing Zhang, Weimin Zhou, Jianpin Zhang
Filling of very deep, wide trenches by BenzoCycloButene polymer
Hicham Eldin Mahfoz Kotb, K. Isoird, F. Morancho, L. Théolier, T. Do Conto
High sensitivity and small size MEMS capacitive microphone using a novel slotted diaphragm
Bahram Azizollah Ganji, Burhanuddin Yeop Majlis
Kinetic masks: a new approach and device for dispersing biologically relevant fluids
Ina Meiser, Stephen Graham Shirley, Heiko Zimmermann
Precision manufacturing of key components for an ultra miniature gas turbine unit for power generation
Kun Liu, Tobias Waumans, Jan Peirs, Dominiek Reynaerts
Influence of processing parameters on micro injection molded weld line mechanical properties of polypropylene (PP)
Lei Xie, Gerhard Ziegmann
Comparison of micro-dispensing performance between micro-valve and piezoelectric printhead
Jie Sun, Jinh Hao Ng, Ying Hsi Fuh, Yoke San Wong, Han Tong Loh, Qian Xu
Factorial experimental design applied to DRIE for optimised process in power electronics applications requiring high-aspect ratio trenches
Magali Brunet, Pascal Dubreuil, Hicham Mahfoz-Kotb, Aline Gouantes, Anne-Marie Dorthe
Thermo-mechanical reliability during technology development of power chip-on-board assemblies with encapsulation
Bernhard Wunderle, K.-F. Becker, R. Sinning, O. Wittler, R. Schacht, H. Walter, M. Schneider-Ramelow, K. Halser, N. Simper, B. Michel, H. Reichl