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Erschienen in: Microsystem Technologies 9-10/2012

01.09.2012 | Technical Paper

Non-operational shock analysis and design of head gimbal assembly in spinning data storage devices

verfasst von: Jen-Yuan Chang, Rana Noman Mubarak

Erschienen in: Microsystem Technologies | Ausgabe 9-10/2012

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Abstract

The work presented in this paper was motivated by the experimental observation of de-bonding phenomena between head gimbal assembly (HGA) and suspension for a commercial 3.5-in. enterprise HDD under non-operational 250 G shock test, which leads to revisit design of HGA/suspension with objective placed on withstanding shocks between the head slider and the suspension. In this study experimental observation and numerical finite element studies were conducted to understand such effect on the mechanical failure of HGA when it is subjected to non-operational shock in parked position on ramp. It was observed that by changing flexure angle in HGA, shock stress can be reduced. FEA simulation results have been presented to verify the findings.

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Metadaten
Titel
Non-operational shock analysis and design of head gimbal assembly in spinning data storage devices
verfasst von
Jen-Yuan Chang
Rana Noman Mubarak
Publikationsdatum
01.09.2012
Verlag
Springer-Verlag
Erschienen in
Microsystem Technologies / Ausgabe 9-10/2012
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1572-3

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