Optimization of ceramics bonding in the area of pressure sensor manufacturing

Ceramics joints are applied for producing products that should be made in a general shapes and dimensions for more advantageous usage. The article presents the research work related to ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in the electronics industry and motivation for joining ceramics is described in the introduction. The requirements and methods for improving the quality of joints are summarized. Also, the results of simulations of pressure sensor cooling after removal from the oven during joining are discussed. The experimental results are evaluated by using a t-test before and after process cooling modification. Important directions for future research are summarized, with emphasis on the statistical determination of poor connection, and how the interface of modification of joint technology and process setting affects results and parameters that have been achieved.