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Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies Kapitel lesen Erstes Kapitel lesen

2010 | OriginalPaper | Buchkapitel

3. Polymeric Microelectromechanical Millimeter Wave Systems

verfasst von : Yiin-Kuen Fuh, Firas Sammoura, Yingqi Jiang, Liwei Lin

Erschienen in: RF and Microwave Microelectronics Packaging

Verlag: Springer US

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Abstract

Polymeric millimeter-wave components and systems based on micro molding technologies have been demonstrated, including waveguides, iris filters, tunable filters, phase shifters, waveguide-fed horn antennas and waveguide-based feeding networks. Fundamental issues in polymer metallization process such as conformal and uniform deposition as well as mass transfer and current density effects on the novel in-channel electroplating encapsulation, surface morphology and roughness on mm-wave attenuation will be discussed in detail. We believe this new class of polymeric millimeter-wave systems has potential applications in replacing the expensive metallic counterparts (a few thousand dollars for each waveguide) in current millimeter-wave systems.

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Vorheriges Kapitel Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages
Nächstes Kapitel Millimeter-Wave Chip-on-Board Integration and Packaging
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Metadaten
Titel
Polymeric Microelectromechanical Millimeter Wave Systems
verfasst von
Yiin-Kuen Fuh
Firas Sammoura
Yingqi Jiang
Liwei Lin
Copyright-Jahr
2010
Verlag
Springer US
Buch
RF and Microwave Microelectronics Packaging

Print ISBN: 978-1-4419-0983-1

Electronic ISBN: 978-1-4419-0984-8

Copyright-Jahr: 2010

DOI
https://doi.org/10.1007/978-1-4419-0984-8_3

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