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Erschienen in: Microsystem Technologies 9/2017

07.01.2016 | Technical Paper

Reliability design of thermally actuated MEMS switches based on V-shape beams

verfasst von: Marius Pustan, Radu Chiorean, Corina Birleanu, Cristian Dudescu, Raluca Muller, Angela Baracu, Rodica Voicu

Erschienen in: Microsystem Technologies | Ausgabe 9/2017

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Abstract

This paper presents the design and fabrication of the thermally actuated MEMS switches based on out-of-plane V-beams. The purpose of this research is to analyze the mechanical response of a V-thermal actuator fabricated from aluminum in order to improve the accuracy in response and to increase the switch lifetime. The actuation of this kind of switches is based on the thermal displacement of the mobile electrode under thermal load that is generated when the actuation voltage is applied. It can be used either as a capacitive switch or as a metal-to-metal one. The displacement of the mobile electrode for a given temperature is analytically calculated and validated both numerically and experimentally. Experimental investigations are performed on a macro-scale sample using a 3D digital image correlation measuring system, a heating source and a thermal camera for temperature monitoring. The first fabrication steps of the MEMS switch based on the V-beam thermal actuator are presented. The out-of-plane V-beams thermal MEMS switches can be monolithically integrated in RF applications.

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Literatur
Zurück zum Zitat Baker MS, Walraven JA, Headley TJ, Plass RA (2004) Final report: compliant thermo-mechanical MEMS actuators, LDRD# 52553. Department of Energy, United States Baker MS, Walraven JA, Headley TJ, Plass RA (2004) Final report: compliant thermo-mechanical MEMS actuators, LDRD# 52553. Department of Energy, United States
Zurück zum Zitat Chiorean R, Dudescu C, Pustan M, Hărdău M (2014) Deflection determination of V-beam thermal sensors using digital image correlation. In: Key engineering materials, 2014. Trans Tech Publ, pp 41–44 Chiorean R, Dudescu C, Pustan M, Hărdău M (2014) Deflection determination of V-beam thermal sensors using digital image correlation. In: Key engineering materials, 2014. Trans Tech Publ, pp 41–44
Zurück zum Zitat Dudescu C, Botean A, Hardau M (2013) Thermal expansion coefficient determination of polymeric materials using digital image correlation. Mater Plast 50:55–59 Dudescu C, Botean A, Hardau M (2013) Thermal expansion coefficient determination of polymeric materials using digital image correlation. Mater Plast 50:55–59
Zurück zum Zitat Li X et al. (2010) Electro-thermally actuated RF MEMS switch for wireless communication. In: Nano/micro engineered and molecular systems (NEMS), 2010. 5th IEEE international conference on, 2010. IEEE, pp 497–500 Li X et al. (2010) Electro-thermally actuated RF MEMS switch for wireless communication. In: Nano/micro engineered and molecular systems (NEMS), 2010. 5th IEEE international conference on, 2010. IEEE, pp 497–500
Zurück zum Zitat Li X, Zhao Y, Hu T, Xu W, Zhao Y, Bai Y, Ren W (2015) Design of a large displacement thermal actuator with a cascaded V-beam amplification for MEMS safety-and-arming devices Microsyst Technol 1–8 doi: 10.1007/s00542-015-2447-1 Li X, Zhao Y, Hu T, Xu W, Zhao Y, Bai Y, Ren W (2015) Design of a large displacement thermal actuator with a cascaded V-beam amplification for MEMS safety-and-arming devices Microsyst Technol 1–8 doi: 10.​1007/​s00542-015-2447-1
Zurück zum Zitat Phinney LM, Spletzer MA, Baker MS, Serrano JR (2010) Effects of mechanical stress on thermal microactuator performance. J Micromech Microeng 20:095011CrossRef Phinney LM, Spletzer MA, Baker MS, Serrano JR (2010) Effects of mechanical stress on thermal microactuator performance. J Micromech Microeng 20:095011CrossRef
Zurück zum Zitat Phinney LM, Serrano JR, Baker MS (2012) Thermal microactuators. INTECH Open Access Publisher Phinney LM, Serrano JR, Baker MS (2012) Thermal microactuators. INTECH Open Access Publisher
Zurück zum Zitat Plass RA, Baker MS, Walraven JA (2004) Electrothermal actuator reliability studies. In: Micromachining and Microfabrication, 2004. International Society for Optics and Photonics, pp 15–21 Plass RA, Baker MS, Walraven JA (2004) Electrothermal actuator reliability studies. In: Micromachining and Microfabrication, 2004. International Society for Optics and Photonics, pp 15–21
Zurück zum Zitat Pustan M, Birleanu C, Dudescu C, Belcin O (2013) Temperature effect on tribological and mechanical properties of MEMS, In: Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 14th International Conference on, 2013. IEEE, pp.1-6 Pustan M, Birleanu C, Dudescu C, Belcin O (2013) Temperature effect on tribological and mechanical properties of MEMS, In: Thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE), 14th International Conference on, 2013. IEEE, pp.1-6
Zurück zum Zitat Rawashdeh E, Karam A, Foulds IG (2012) Characterization of kink actuators as compared to traditional chevron shaped bent-beam electrothermal actuators. Micromachines 3:542–549CrossRef Rawashdeh E, Karam A, Foulds IG (2012) Characterization of kink actuators as compared to traditional chevron shaped bent-beam electrothermal actuators. Micromachines 3:542–549CrossRef
Zurück zum Zitat Sassen W, Henneken V, Tichem M, Sarro P (2008) An improved in-plane thermal folded V-beam actuator for optical fibre alignment. J Micromech Microeng 18:075033CrossRef Sassen W, Henneken V, Tichem M, Sarro P (2008) An improved in-plane thermal folded V-beam actuator for optical fibre alignment. J Micromech Microeng 18:075033CrossRef
Zurück zum Zitat Serway R, Jewett J (2012) Principles of physics: a calculus-based text. vol 2. Cengage learning Serway R, Jewett J (2012) Principles of physics: a calculus-based text. vol 2. Cengage learning
Zurück zum Zitat Shivhare P, Uma G, Umapathy M (2015) Design enhancement of a chevron electrothermally actuated microgripper for improved gripping performance Microsyst Technol 1–9 doi:10.1007/s00542-015-2561-0 Shivhare P, Uma G, Umapathy M (2015) Design enhancement of a chevron electrothermally actuated microgripper for improved gripping performance Microsyst Technol 1–9 doi:10.​1007/​s00542-015-2561-0
Zurück zum Zitat Varona J, Tecpoyotl-Torres M, Hamoui AA (2009) Design of MEMS vertical–horizontal chevron thermal actuators. Sens Actuators A 153:127–130CrossRef Varona J, Tecpoyotl-Torres M, Hamoui AA (2009) Design of MEMS vertical–horizontal chevron thermal actuators. Sens Actuators A 153:127–130CrossRef
Zurück zum Zitat Yang Y-J, Liao B-T, Kuo W-C (2007) A novel 2 × 2 MEMS optical switch using the split cross-bar design. J Micromech Microeng 17:875CrossRef Yang Y-J, Liao B-T, Kuo W-C (2007) A novel 2 × 2 MEMS optical switch using the split cross-bar design. J Micromech Microeng 17:875CrossRef
Metadaten
Titel
Reliability design of thermally actuated MEMS switches based on V-shape beams
verfasst von
Marius Pustan
Radu Chiorean
Corina Birleanu
Cristian Dudescu
Raluca Muller
Angela Baracu
Rodica Voicu
Publikationsdatum
07.01.2016
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 9/2017
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2789-8

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