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Erschienen in: Microsystem Technologies 10/2016

23.08.2015 | Technical Paper

Sensitivity improvement using optimized heater design for dual axis thermal accelerometers

verfasst von: R. Mukherjee, P. K. Guha, P. Mandal

Erschienen in: Microsystem Technologies | Ausgabe 10/2016

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Abstract

This paper investigates the sensitivity improvement of an air filled cavity based thermal accelerometer. The accelerometer does not contain any solid proof mass and it is realizable in CMOS technology. The sensitivity has been improved by a new square ring shaped heater structure. The sensitivity of accelerometer performance is compared with other different heater shapes. It is found that, heater design having higher heat dissipation in the suspended beam gives higher sensitivity. The simulation is carried out using commercial FEM simulator COMSOL Multiphysics. For the peak heater temperature of 609 K, the proposed square ring shaped heater provides a sensitivity of 0.335 K/g. Under same conditions, sensitivity of an accelerometer with a meander shaped heater structure is only 0.098 K/g and diamond shaped structure is 0.229 K/g.

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Literatur
Zurück zum Zitat Anderson DA, Tannehill JC, Pletcher RH (1984) Computational fluid mechanics and heat transfer. McGraw-Hill, New York, p 559MATH Anderson DA, Tannehill JC, Pletcher RH (1984) Computational fluid mechanics and heat transfer. McGraw-Hill, New York, p 559MATH
Zurück zum Zitat Chaehoi A, Mailly F, Latorre L, Nouet P (2006) Experimental and finite-element study of convective accelerometer on CMOS. Sens Actuators A 132:78–84CrossRef Chaehoi A, Mailly F, Latorre L, Nouet P (2006) Experimental and finite-element study of convective accelerometer on CMOS. Sens Actuators A 132:78–84CrossRef
Zurück zum Zitat Chan C, Lo S, Huang Y, Wu M, Wang M, Fang W (2012) Poly-Si based two-axis differential capacitive-sensing accelerometer. IEEE Sens J 12(12):3301–3308CrossRef Chan C, Lo S, Huang Y, Wu M, Wang M, Fang W (2012) Poly-Si based two-axis differential capacitive-sensing accelerometer. IEEE Sens J 12(12):3301–3308CrossRef
Zurück zum Zitat Dai G, Li M, He X, Du L, Shao B, Su W (2011) Thermal drift analysis using a multiphysics model of bulk silicon MEMS capacitive accelerometer. Sens Actuators A 172:369–378CrossRef Dai G, Li M, He X, Du L, Shao B, Su W (2011) Thermal drift analysis using a multiphysics model of bulk silicon MEMS capacitive accelerometer. Sens Actuators A 172:369–378CrossRef
Zurück zum Zitat Garraud A, Giani A, Combette P, Charlot B, Richard M (2011a) A dual axis CMOS micromachined convective thermal accelerometer. Sens Actuators A 170:44–50CrossRef Garraud A, Giani A, Combette P, Charlot B, Richard M (2011a) A dual axis CMOS micromachined convective thermal accelerometer. Sens Actuators A 170:44–50CrossRef
Zurück zum Zitat Garraud A, Combette P, Gosalbes JM, Charlot B, Richard M, Giani A (2011b) First high-g measurement by thermal accelerometers, Transducers’11, Beijing, China, June 5–9, 2011 Garraud A, Combette P, Gosalbes JM, Charlot B, Richard M, Giani A (2011b) First high-g measurement by thermal accelerometers, Transducers’11, Beijing, China, June 5–9, 2011
Zurück zum Zitat Kollias AT, Avaritsiotis JN (2005) A study on the performance of bending mode piezoelectric accelerometers. Sens Actuators A 121:434–442CrossRef Kollias AT, Avaritsiotis JN (2005) A study on the performance of bending mode piezoelectric accelerometers. Sens Actuators A 121:434–442CrossRef
Zurück zum Zitat Leung AM, Jones J, Czyzewska E, Chen J, Woods B (1998) Micromachined accelerometer based on convection heat transfer. In: Proceedings of the IEEE MEMS’98, Heidelberg, Germany, January 25–29, 1998, pp 627–630 Leung AM, Jones J, Czyzewska E, Chen J, Woods B (1998) Micromachined accelerometer based on convection heat transfer. In: Proceedings of the IEEE MEMS’98, Heidelberg, Germany, January 25–29, 1998, pp 627–630
Zurück zum Zitat Levinzon FA (2012) Ultra-low-noise seismic piezoelectric accelerometer with integral FET amplifier. IEEE Sens J 12(6):2262–2268CrossRef Levinzon FA (2012) Ultra-low-noise seismic piezoelectric accelerometer with integral FET amplifier. IEEE Sens J 12(6):2262–2268CrossRef
Zurück zum Zitat Li Y, Zheng Q, Hu Y, Xu Y (2011) Micromachined piezoresistive accelerometers based on an asymmetrically gapped cantilever. J Microelectromech Syst 20(1):83–94CrossRef Li Y, Zheng Q, Hu Y, Xu Y (2011) Micromachined piezoresistive accelerometers based on an asymmetrically gapped cantilever. J Microelectromech Syst 20(1):83–94CrossRef
Zurück zum Zitat Mezghani B, Tounsi F, Rekik A, Mailly F, Masmoudi M, Nouet P (2013) Sensitivity and power modeling of CMOS MEMS single axis convective accelerometers. Microelectron J 44(12):1092–1098CrossRef Mezghani B, Tounsi F, Rekik A, Mailly F, Masmoudi M, Nouet P (2013) Sensitivity and power modeling of CMOS MEMS single axis convective accelerometers. Microelectron J 44(12):1092–1098CrossRef
Zurück zum Zitat Mezghani B, Tounsi F, Masmoudi M (2014) Convection behavior analysis of CMOS MEMS thermal accelerometers using FEM and Hardee’s model. Analog Integr Circ Signal Process 78:301–311CrossRef Mezghani B, Tounsi F, Masmoudi M (2014) Convection behavior analysis of CMOS MEMS thermal accelerometers using FEM and Hardee’s model. Analog Integr Circ Signal Process 78:301–311CrossRef
Zurück zum Zitat Park U, Park B, Moon K, Kim D, Kim J (2011) Development of a dual-axis micromachined convective accelerometer with an effective heater geometry. J Microelectron Eng 88:276–281CrossRef Park U, Park B, Moon K, Kim D, Kim J (2011) Development of a dual-axis micromachined convective accelerometer with an effective heater geometry. J Microelectron Eng 88:276–281CrossRef
Zurück zum Zitat Shamshirsaz M, Bahrami M, Asgari MB, Tayefeh M (2007) Analysis of polysilicon micro beams buckling with temperature dependent properties. DTIP of MEMS/MOEMS, Stresa, Italy, April 25–27, 2007 Shamshirsaz M, Bahrami M, Asgari MB, Tayefeh M (2007) Analysis of polysilicon micro beams buckling with temperature dependent properties. DTIP of MEMS/MOEMS, Stresa, Italy, April 25–27, 2007
Zurück zum Zitat Song C, Shinn M (1998) Commercial vision of silicon based inertial sensors. Sens Actuators A 66:231–236CrossRef Song C, Shinn M (1998) Commercial vision of silicon based inertial sensors. Sens Actuators A 66:231–236CrossRef
Zurück zum Zitat Tao J, Cheung NW, Hu C (1993) Metal electromigration damage healing under bidirectional current stress, IEEE Electron Device Lett 14(12):554–556CrossRef Tao J, Cheung NW, Hu C (1993) Metal electromigration damage healing under bidirectional current stress, IEEE Electron Device Lett 14(12):554–556CrossRef
Zurück zum Zitat Yang Y, Chen S, Lin W, Tu W, Huang C, Liu W, Shen C (2007) A new approach of 2D CMOS thermal-bubble-based accelerometer. The 33rd annual conference of the IEEE Industrial Electronics Society (IECON) Nov. 5–8, 2007, Taipei, Taiwan Yang Y, Chen S, Lin W, Tu W, Huang C, Liu W, Shen C (2007) A new approach of 2D CMOS thermal-bubble-based accelerometer. The 33rd annual conference of the IEEE Industrial Electronics Society (IECON) Nov. 5–8, 2007, Taipei, Taiwan
Zurück zum Zitat Zhao Y, Li X, Liang J, Jiang Z (2013) Design, fabrication and experiment of a MEMS piezoresistive high-g accelerometer. J Mech Sci Technol 27(3):831–836CrossRef Zhao Y, Li X, Liang J, Jiang Z (2013) Design, fabrication and experiment of a MEMS piezoresistive high-g accelerometer. J Mech Sci Technol 27(3):831–836CrossRef
Metadaten
Titel
Sensitivity improvement using optimized heater design for dual axis thermal accelerometers
verfasst von
R. Mukherjee
P. K. Guha
P. Mandal
Publikationsdatum
23.08.2015
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 10/2016
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-015-2658-5

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