Ausgabe 1/2014
Special Sections from the 2013 TMS Annual Meeting: Lead-Free Solders; Advanced Materials for Power Electronics and Power Conditioning Systems; and Phase Stability, Phase Transformations, and Reaction Phase Formation in Electronic Materials. Guest Editors: Darrel Frear, Rachael Myers-Ward, Paul Ohodnicki, and Chaohong Wang
Inhalt (37 Artikel)
Mitigation of Sn Whisker Growth by Small Bi Additions
Jung-Lae Jo, Shijo Nagao, Kyoko Hamasaki, Masanobu Tsujimoto, Tohru Sugahara, Katsuaki Suganuma
Fluxless Tin and␣Silver-Indium Bonding Processes for␣Silicon onto␣Aluminum
Chin C. Lee, Shou-Jen Hsu, Yuan-Yun Wu
Optimization of the Ni(P) Thickness for an Ultrathin Ni(P)-Based Surface Finish in Soldering Applications
C. E. Ho, S. J. Wang, C. W. Fan, W. H. Wu
Effects of POSS-Silanol Addition on Whisker Formation in Sn-Based Pb-Free Electronic Solders
Sihan Liu, Limin Ma, Yutian Shu, K. N. Subramanian, Andre Lee, Fu Guo
Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy
H.X. Xie, D. Friedman, K. Mirpuri, N. Chawla
The Influence of Sn Orientation on Intermetallic Compound Evolution in Idealized Sn-Ag-Cu 305 Interconnects: an Electron Backscatter Diffraction Study of Electromigration
Xioranny Linares, Chris Kinney, Kyu-Oh Lee, J. W. Morris Jr.
Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-Ray Diffraction and Finite-Element Analysis
Hsueh-Hsien Hsu, Tz-Cheng Chiu, Tao-Chih Chang, Shin-Yi Huang, Hsin-Yi Lee, Ching-Shun Ku, Yang-Yi Lin, Chien-Hao Su, Li-Wei Chou, Yao-Tsung Ouyang, YI-Ting Huang, Albert T. Wu
Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications
Bite Zhou, Govindarajan Muralidharan, Kanth Kurumadalli, Chad M. Parish, Scott Leslie, Thomas R. Bieler
Influence of High-G Mechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects
Tae-Kyu Lee, Choong-Un Kim, Thomas R. Bieler
Incorporation of Interfacial Intermetallic Morphology in Fracture Mechanism Map for Sn-Ag-Cu Solder Joints
Z. Huang, P. Kumar, I. Dutta, R. Sidhu, M. Renavikar, R. Mahajan
Multiphase Resistivity Model for Magnetic Nanocomposites Developed for High Frequency, High Power Transformation
V. DeGeorge, S. Shen, P. Ohodnicki, M. Andio, M. E. McHenry
Electromigration in Sintered Nanoscale Silver Films at Elevated Temperature
Jesus N. Calata, Guo-Quan Lu, Khai Ngo, Luu Nguyen
Texture and Magnetic Properties of Rolled Fe-6.5 wt.%Si Thin Sheets
Y. C. Yao, Y. H. Sha, J. L. Liu, F. Zhang, L. Zuo
Soft Magnetic Alloy–Polymer Composite for High-Frequency Power Electronics Application
Jesus N. Calata, Guo-Quan Lu, Khai Ngo
Study on the Effects of Adipic Acid on Properties of Dicyandiamide-Cured Electrically Conductive Adhesive and the Interaction Mechanism
Ling Wang, Chao Wan, Yonggao Fu, Hongtao Chen, Xiaojian Liu, Mingyu Li
Effect of Mo Addition on Structure and Magnetocaloric Effect in γ-FeNi Nanocrystals
Huseyin Ucar, Mark Craven, D. E. Laughlin, M. E. McHenry
Structure–Property Correlations in CoFe–SiO2 Nanogranular Films Utilizing x-Ray Photoelectron Spectroscopy and Small-Angle Scattering Techniques
P.R. Ohodnicki Jr., V. Sokalski, J. Baltrus, J.B. Kortright, X. Zuo, S. Shen, V. DeGeorge, M.E. McHenry, D.E. Laughlin
Characterization of ALD Beryllium Oxide as a Potential High-k Gate Dielectric for Low-Leakage AlGaN/GaN MOSHEMTs
Derek W. Johnson, Jung Hwan Yum, Todd W. Hudnall, Ryan M. Mushinski, Christopher W. Bielawski, John C. Roberts, Wei-E Wang, Sanjay K. Banerjee, H. Rusty Harris
Interfacial Reactions of High-Bi Alloys on Various Substrates
Jin-Yi Wang, Chih-Ming Chen, Yee-Wen Yen
Nanomeshed Pt(Au) Transparent Contact to p-GaN of Light-Emitting Diode
Xu Feng Li, Cheng-Chieh Chang, Yen-Shuo Liu, Po-Han Chen, Cheng-Yi Liu
Effect of Metal Bond-Pad Configurations on the Solder Microstructure Development of Flip-Chip Solder Joints
Y. J. Hu, Y. C. Hsu, T. S. Huang, C. T. Lu, Albert T. Wu, C. Y. Liu
Experimental Studies and Thermodynamic Assessment of Ternary Cu-Pd-Sn Phase Relations Focusing on the Sn-Rich Alloys
Md. Arifur Rahman, Chia-Wei Fan, Shin-Ju Wang, Cheng-En Ho, Wojciech Gierlotka
Interfacial Reactions of Sn, Sn-3.0Ag-0.5Cu, and Sn-9Zn Lead-Free Solders with Fe-42Ni Substrates
Yee-Wen Yen, Yu-Ping Hsieh, Chien-Chung Jao, Chao-Wei Chiu, Yi-Shan Li
Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders
Chao-hong Wang, Wei-han Lai, Sinn-wen Chen
Characteristics of Plasma-Treated Amorphous Ta-Si-C Film as a Diffusion Barrier for Copper Metallization
Jau-Shiung Fang, Wu-Jia Su, Meng-Shuo Huang, Chin-Fu Chiu, Tsung-Shune Chin
EBSD Investigation of Cu-Sn IMC Microstructural Evolution in Cu/Sn-Ag/Cu Microbumps During Isothermal Annealing
S. J. Wang, L. H. Hsu, N. K. Wang, C. E. Ho
Optical Properties of Al x O y /Ni/Al x O y Multilayered Absorber Coatings Prepared by Reactive DC Magnetron Sputtering
T. K. Tsai, S. J. Hsueh, J. S. Fang
Evaluation of Electromigration Behaviors of Pb-Free Microbumps in Three-Dimensional Integrated Circuit Packaging
Hao Hsu, Tzu-Yang Lin, Fan-Yi Ouyang
Kinetics of Reactive Diffusion in the (Pd-Cu)/Sn System at Solid-State Temperatures
M. Hashiba, W. Shinmei, M. Kajihara
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions
Jaewon Chang, Sung K. Kang, Jae-Ho Lee, Keun-Soo Kim, Hyuck Mo Lee
Joule-Heating-Induced Damage in Cu-Al Wedge Bonds Under Current Stressing
Tsung-Han Yang, Yu-Min Lin, Fan-Yi Ouyang
Interfacial Reactions Between Columnar or Layered Ni(P) Layers and Sn-Ag-Cu Solder
Y.J. Hu, Y.C. Hsu, C.T. Lu, T.S. Huang, C.Y. Chen, W.N. Chuang, C.Y. Hsiao, C.P. Lin, C.Y. Liu
Polarity Effect in a Sn3Ag0.5Cu/Bismuth Telluride Thermoelectric System
P. Y. Chien, C. H. Yeh, H. H. Hsu, Albert T. Wu
Effects of Sodium Citrate Concentration on Electroless Ni-Fe Bath Stability and Deposition
Myung-Won Jung, Sung K. Kang, Jae-Ho Lee