Ausgabe 10/2007
Inhalt (29 Artikel)
Foreword
M. Parans Paranthaman, Venkat Selvamanickam, Kaname Matsumoto, Luigia Gianni, Wei Zhang, Amit Goyal, Winnie Wong-Ng
Epitaxial Growth of High-J c NdBa2Cu3O7−δ Films on RABiTS by Pulsed Laser Deposition
S.H. Wee, A. Goyal, J. Li, Y. Zhang, L. Heatherly
Superconducting Properties of (M x /YBa2Cu3O7−δy )N Multilayer Films with Variable Layer Thickness x
T.J. Haugan, P.N. Barnes, T.A. Campbell, N.A. Pierce, F.J. Baca, M.F. Locke, I. Brockman, A.L. Westerfield, J.M. Evans, R. Morgan, P. Klenk, B.C. Harrison, A.D. Chaney, I. Maartense
Solution-Based Approaches to Fabrication of YBa2Cu3O7−δ (YBCO): Precursors of Tri-Fluoroacetate (TFA) and Nanoparticle Colloids
S. M. Mukhopadhyay, J. Su, V. Chintamaneni
Superconductivity of YBCO Thick Films Prepared by Spark Plasma Sintering
Youngha Kim, Kyong H. Lee, Tae-Hyun Sung, Sang-Chul Han, Young-Hee Han, Nyeon-Ho Jeong, Kwangsoo No
Textured Ion-Beam Assisted Deposition: Magnesium Oxide Template on Non-Metallic Flexible Ceraflex for Epitaxial Growth of Perovskite Films
Rongtao Lu, Judy Z. Wu, Chakrapani Varanasi, Jack Burke, Iman Maartense, Paul N. Barnes
Yield Strengths of Biaxially Textured Metallic Substrates (Ni and its Alloys) Determined Using a Simplified Test Method
Chakrapani V. Varanasi, Leon Chuck, Lyle Brunke, Jack Burke, Andrew D. Chaney, Paul N. Barnes
Chemical Solution-Based Epitaxial Oxide Films on Biaxially Textured Ni-W Substrates with Improved Out-of-Plane Texture for YBCO-Coated Conductors
M.S. Bhuiyan, M. Paranthaman, S. Sathyamurthy
Electrodeposited Gd2Zr2O7 and Gd2O3 Buffer Layers for YBa2Cu3O7-δ Superconductors
Raghu N. Bhattacharya, Sovannary Phok
Phase Equilibria of BaO-R2O3-CuO z Systems (R = Y and Lanthanides) under CO2-free Conditions
W. Wong-Ng, Z. Yang, L.P Cook, J. Frank, M. Loung, Q. Huang
Kinetic Studies of the Interfacial Reaction of the Ba2YCu3O6+x Superconductor with a CeO2 Buffer
L.P. Cook, W. Wong-Ng, P. Schenck, Z. Yang, I. Levin, J. Frank
Fabrication of Bi2Sr2CaCu2O x and Bi2Sr2Ca2Cu3O x Superconductor Thick Films by Using Cu-Free Precursors on Ni Substrates
Nyeon-Ho Jeong, Sang-Chul Han, Young-Hee Han, Tae-Hyun Sung, Jung-Hyun Yoon, Chi-Woo Lee
Transport and Mobility Properties of Bulk Indium Nitride (InN) and a Two-Dimensional Electron Gas in an InGaN/GaN Quantum Well
Z. Yarar, B. Ozdemir, M. Ozdemir
Growth of In-Rich In x Al1−x N Films on (0001) Sapphire by RF-MBE and their Properties
H. Naoi, K. Fujiwara, S. Takado, M. Kurouchi, D. Muto, T. Araki, H. Na, Y. Nanishi
Neutron Radiation Effects in Epitaxially Laterally Overgrown GaN Films
A. Y. Polyakov, N. B. Smirnov, A. V. Govorkov, A. V. Markov, E. B. Yakimov, P. S. Vergeles, N. G. Kolin, D. I. Merkurisov, V. M. Boiko, In-Hwan Lee, Cheul-Ro Lee, S. J. Pearton
Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection
Tao Wang, Xu Chen, Guo-Quan Lu, Guang-Yin Lei
Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives
Myung Jin Yim, Yi Li, Kyoung Sik Moon, C.P. Wong
Relieving Hot-Spot Temperature and Current Crowding Effects During Electromigration in Solder Bumps by Using Cu Columns
S.W. Liang, Y.W. Chang, Chih Chen
Solid-State Reactions between Cu(Ni) Alloys and Sn
Vesa Vuorinen, Tomi Laurila, Toni Mattila, Erkki Heikinheimo, Jorma K. Kivilahti
Interfacial Reactions between Eutectic SnZn Solder and Bulk or Thin-Film Cu Substrates
Chih-ming Chen, Chih-hao Chen
Current-Induced Phase Partitioning in Eutectic Indium-Tin Pb-Free Solder Interconnect
John P. Daghfal, J. K. Shang
The Hillock Formation in a Cu/Sn-9Zn/Cu Lamella upon Current Stressing
Shih-Ming Kuo, Kwang-Lung Lin
Regression Analysis for Complex Doping of X8R Ceramics Based on Uniform Design
Bin Tang, Shuren Zhang, Xiaohua Zhou, Ding Wang, Ying Yuan
A Novel Approach to BaTiO3-based X8R Ceramics by Calcium Borosilicate Glass Ceramic Doping
Min Du, Yanrong Li, Ying Yuan, Shuren Zhang, Bin Tang
Thermoelectric Properties of NaCo2 − x Fe x O y
Biprodas Dutta, Jugdersuren Battogtokh, David A. McKeown, Igor Vidensky, Neilanjan Dutta, Ian L. Pegg
Cross-Interaction of Interfacial Reactions in Ni (Au/Ni/Cu)-SnAg-Cu Solder Joints during Reflow Soldering and Thermal Aging
H.T. Chen, C.Q. Wang, C. Yan, M.Y. Li, Y. Huang