Ausgabe 11/1999
Inhalt (27 Artikel)
Development of under bump metallizations for flip chip bonding to organic substrates
T. M. Korhonen, P. Su, S. J. Hong, M. A. Korhonen, C. -Y. Li
Reliability of a flip-chip package thermally loaded between −55°C and 125°C
Elizabeth S. Drexler
A novel test circuit for automatically detecting electrochemical migration and conductive anodic filament formation
W. Jud Ready, Laura J. Turbini, Roger Nickel, John Fischer
Thermodynamic database for phase diagrams in micro-soldering alloys
I. Ohnuma, X. J. Liu, H. Ohtani, K. Ishida
Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching use
T. Shimizu, H. Ishikawa, I. Ohnuma, K. Ishida
Microstructural engineering of solders
K. N. Subramanian, T. R. Bieler, J. P. Lucas
Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated Cu6Sn5 reinforcements
Jeff Sigelko, S. Choi, K. N. Subramanian, James P. Lucas, T. R. Bieler
Forming high temperature solder joints through liquid phase sintering of solder paste
Mark A. Palmer, Nicole S. Erdman, David A. McCall
An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substrates
S. Chada, W. Laub, R. A. Fournelle, D. Shangguan
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging
S. Choi, T. R. Bieler, J. P. Lucas, K. N. Subramanian
Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assembly
Hitoshi Tanaka, Morimasa Tanimoto, Akira Matsuda, Takeo Uno, Masaaki Kurihara, Shoji Shiga
Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactions
A. S. Zuruzi, C. -H. Chiu, S. K. Lahiri, K. M. Chua
Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering
C. E. Ho, Y. M. Chen, C. R. Kao
Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Pd metallizations
G. Ghosh
Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate
Won Kyoung Choi, Hyuck Mo Lee
The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic solders
Jae Yong Park, Choon Sik Kang, Jae Pil Jung
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder joints
Yoshiharu Kariya, Yasunori Hirata, Masahisa Otsuka
Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique
J. P. Lucas, F. Guo, J. McDougall, T. R. Bieler, K. N. Subramanian, J. K. Park
Solder joint reliability in alternator power diode assemblies
Tsung-Yu Pan, Steven C. White, Edwin L. Lutz, Howard D. Blair, John M. Nicholson
Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloy
Noboru Wade, Tatsuo Akuzawa, Seiji Yamada, Daigo Sugiyama, Ick-Soo Kim, Kazuya Miyahara
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue
P. T. Vianco, S. N. Burchett, M. K. Neilsen, J. A. Rejent, D. R. Frear
Characterizing the weak organic acids used in low solids fluxes
Brian A. Smith, Laura J. Turbini
Z-Axis anisotropic electrical conductor films in adhesive and standalone forms for electrical interconnection
Yunsheng Xu, D. D. L. Chung
Development of conducting adhesive materials for microelectronic applications
Sung K. Kang, S. Purushothaman
Transient liquid phase sintering composites: Polymer adhesives with metallurgical bonds
Catherine Shearer, Bryan Shearer, Goran Matijasevic, Pradeep Gandhi