Ausgabe 12/2006
Inhalt (14 Artikel)
Special Issue Paper
Foreword
Nik Chawla, Srinivas Chada, Sung K. Kang, C. Robert Kao, Kwang -Lung Lin, Jim Lucas, Laura Turbini
Special Issue Paper
The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
Huann-Wu Chiang, Kenndy Chang, Jun-Yuan Chen
Special Issue Paper
Morphology and growth pattern transition of intermetallic compounds between Cu and Sn-3.5Ag containing a small amount of additives
Feng Gao, Tadashi Takemoto, Hiroshi Nishikawa
Special Issue Paper
Microstructure and mechanical behavior of novel rare earth-containing Pb-Free solders
M. A. Dudek, R. S. Sidhu, N. Chawla, M. Renavikar
Special Issue Paper
Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
M. He, V. L. Acoff
Special Issue Paper
Nanoindentation on SnAgCu lead-free solder joints and analysis
Luhua Xu, John H. L. Pang
Special Issue Paper
Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint
Luhua Xu, John H. L. Pang, Fei Ren, K. N. Tu
Special Issue Paper
Effect of phosphorus content on Cu/Ni-P/Sn-3.5Ag solder joint strength after multiple reflows
Zhong Chen, Aditya Kumar, M. Mona
Special Issue Paper
Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates
Chia-Wei Huang, Kwang-Lung Lin
Regular Issue Paper
Thickness determination of ultrathin oxide films and its application in magnetic tunnel junctions
J. Joshua Yang, Chengxiang Ji, Ying Yang, Y. Austin Chang, Feng X. Liu, Bharat B. Pant, Allan E. Schultz
Regular Issue Paper
Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration
Y. L. Lin, Y. S. Lai, C. M. Tsai, C. R. Kao
Regular Issue Paper
Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys
Jenn-Ming Song, Chi-Feng Huang, Hsin-Yi Chuang
Regular Issue Paper
Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology
Yu-Ching Hsu, Jenq-Gong Duh
Letters
Cathodoluminescence study of micro-crack-induced stress relief for AlN films on Si(111)
G. Sarusi, O. Moshe, S. Khatsevich, D. H. Rich, J. Salzman, B. Meyler, M. Shandalov, Y. Golan