Ausgabe 6/2007
Inhalt (12 Artikel)
Regular Issue Paper
A Study of Deep Defect Levels in Semi-Insulating SiC Using Optical Admittance Spectroscopy
Wonwoo Lee, M. E. Zvanut
Low Damage Etching of GaN Surfaces via Bias-Assisted Photoenhanced Electrochemical Oxidation in Deionized Water
Emre Alptekin, Hongbo Yu, Ekmel Ozbay, Ozgur Aktas
Ultra-Thin Si1−x Ge x Dislocation Blocking Layers for Ge/Strained Si CMOS Devices
Sachin Joshi, Sagnik Dey, Michelle Chaumont, Alan Campion, Sanjay K. Banerjee
Low Leakage Current Transport and High Breakdown Strength of Pulsed Laser Deposited HfO2/SiC Metal-Insulator-Semiconductor Device Structures
S. S. Hullavarad, D. E. Pugel, E. B. Jones, R. D. Vispute, T. Venkatesan
Structural and Optical Properties of ZnO Nanotips Grown on GaN Using Metalorganic Chemical Vapor Deposition
J. Zhong, G. Saraf, H. Chen, Y. Lu, Hock M. Ng, T. Siegrist, A. Parekh, D. Lee, E. A. Armour
Electrically Nonconductive Thermal Pastes with Carbon as the Thermally Conductive Component
Chuangang Lin, Timothy A. Howe, D.D.L. Chung
The Dependence on Thermal History of the Electrical Properties of an Epoxy-Based Isotropic Conductive Adhesive
Masahiro Inoue, Katsuaki Suganuma
The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders
Kil-Won Moon, Ursula R. Kattner, Carol A. Handwerker
Design of Solder Joint Structure for Flip Chip Package with an Optimized Shear Test Method
Jong-Woong Kim, Seung-Boo Jung
Recovery of Dry Etching–Induced Damage in n-GaN by Nitrogen Plasma Treatment at Growth Temperature
X. Wang, G. Yu, B. Lei, X. Wang, C. Lin, Y. Sui, S. Meng, M. Qi, A. Li