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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 6/2012

01.06.2012

Study on properties of Sn–9Zn–Ga solder bearing Nd

verfasst von: Peng Xue, Song-bai Xue, Yi-fu Shen, Hong Zhu, Li–li Gao

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 6/2012

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Abstract

The effects of Nd on wettability, microstructure and mechanical properties of Sn–9Zn–Ga–xNd lead-free solder were investigated. The results indicate that adding moderate amount of rare earth Nd, the wettability as well as mechanical properties of Sn–9Zn–0.5Ga solder were evidently improved, and when the content of Nd is at 0.08 wt%, the best wettability and comprehensive properties of soldered joint were obtained. It was also found that the addition of rare earth Nd could refine the microstructure of the solder, but some dark NdSn3 phase appeared when the addition of Nd exceeded 0.15 wt%. Moreover, the IMCs thickness at the solder/Cu interface was reduced with the addition of Nd which gave a favorable influence on the mechanical property of the soldered joints.
Vorheriger Artikel Microwave dielectric properties of BaNb(2−x)TaxP2O11 (x = 0, 0.5, 1, 1.5 and 2) ceramics

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Metadaten
Titel
Study on properties of Sn–9Zn–Ga solder bearing Nd
verfasst von
Peng Xue
Song-bai Xue
Yi-fu Shen
Hong Zhu
Li–li Gao
Publikationsdatum
01.06.2012
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 6/2012
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-011-0586-4

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