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Microsystem Technologies
Erschienen in: Microsystem Technologies 7/2015

01.07.2015 | Technical Paper

Tools for ultrasonic hot embossing

verfasst von: S. Liao, C. Gerhardy, J. Sackmann, W. K. Schomburg

Erschienen in: Microsystem Technologies | Ausgabe 7/2015

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Abstract

Ultrasonic hot embossing has been developed in recent years enabling quick and flexible fabrication of micro structures from thermoplastic polymers. This paper describes many possibilities of the fabrication, use, and limits of tools for this process. Tools have been produced by milling, drilling, silicon etching, photo and X-ray lithography, and electroplating and by combining these processes.
Vorheriger Artikel Analytical parametric study of head-mounting block for reduction in spring-back deformation after ball swaging in hard disk drives
Nächster Artikel Laser moulding, a new low-cost fabrication process for micro- and nanostructured components

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Metadaten
Titel
Tools for ultrasonic hot embossing
verfasst von
S. Liao
C. Gerhardy
J. Sackmann
W. K. Schomburg
Publikationsdatum
01.07.2015
Verlag
Springer Berlin Heidelberg
Erschienen in
Microsystem Technologies / Ausgabe 7/2015
Print ISSN: 0946-7076
Elektronische ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-014-2232-6

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