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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 4/2015

01.04.2015

Wettability optimization analysis of lead-free solders with Taguchi method

verfasst von: Liang Zhang, Lei Sun, Ji-guang Han, Yong-huan Guo

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 4/2015

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Abstract

In this paper, the wettability of lead-free solders on substrates with fluxes was studied based on reflow process and Taguchi method. Effects of different control factors, including solder materials, fluxes, substrate materials and atmosphere on the wettability of the lead-free solder joints were examined and calculated. Moreover, the effect of rare earth Eu on the wetting of SnAgCu solder was investigated, the effect mechanism was analyzed too. The wettability optimal design in the lead-free solders system has the combination of the SnAgCu-0.04Eu solder, RMA flux, Au/Ni/Cu substrate, and vacuum atmosphere. Moreover, the flux is the most important factor among the control factors in the wettability system.
Vorheriger Artikel Photoelectrochemical solar cell based on surfactant mediated rutile TiO2 nanorods
Nächster Artikel Synthesis of porous titanium dioxide nanorods/nanoparticles and their properties for dye sensitized solar cells

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Metadaten
Titel
Wettability optimization analysis of lead-free solders with Taguchi method
verfasst von
Liang Zhang
Lei Sun
Ji-guang Han
Yong-huan Guo
Publikationsdatum
01.04.2015
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 4/2015
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-015-2730-z

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