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Abstract
The wetting behavior of SnO2-ceramic substrates with metallic melts, such as Au, Ag, Cu, Sn, Ga, Pb, Ni, Al, Ge, Ag-Cu, Ag-Ge, Ag-Si, Cu-Si, Cu-Ni, Cu-Ge, Cu-Sn, Ag-Ti, Sn-Ti, Ag-Cu-Ti, and Cu-Sn-Ti in vacuum, was investigated. Wetting experiments at high temperatures (1270-1370 K) were carried out using sessile drop method with two types of SnO2 ceramics: low-density pure SnO2, and high-density SnO2 with 1 wt.% Fe2O3. Molten copper and its alloys with high Cu-concentration, such as Cu-Ag, Cu-Sn, and Cu-Ni, wet the ceramics, because SnO2 decomposes during heating in vacuum, resulting in formation of oxygen, which dissolves in the melt and acts as an adhesion-active additive. The dependence of the contact angle on the composition of the melt for various binary alloys (Ag-Cu, Ag-Si, Ag-Sn, Cu-Ni, Cu-Sn, and Cu-Si) was investigated. The results showed that the Cu-Ni system is the most promising filler for metallization and vacuum brazing of SnO2 ceramics. A method of vacuum metallization, using Cu-Ni filler, resulting in strong adhesion of coatings, which are uniformly deposited on the SnO2 ceramic surface, is proposed.
Die im Laufe eines Jahres in der „adhäsion“ veröffentlichten Marktübersichten helfen Anwendern verschiedenster Branchen, sich einen gezielten Überblick über Lieferantenangebote zu verschaffen.